Director PostFab Engineering

Job Title

Director PostFab Engineering

Role Summary

Lead the development and industrialization of advanced packaging solutions for next-generation silicon photonics and optical interconnect products. Act as the primary internal owner for packaging development and the external technical/business interface to OSATs, suppliers, ecosystem partners, and key customers.

Experience Level

Senior — typically requires 15+ years of experience in semiconductor packaging, advanced packaging, photonics packaging, or related technologies.

Responsibilities

Drive technical strategy, product readiness, and cross-functional execution from development through production.

• Own package architecture, assembly processes, qualification strategy, and manufacturing readiness for advanced packaging products.
• Build and lead a high-performing engineering organization focused on technical excellence and execution.
• Define and maintain the advanced packaging technology roadmap aligned to product and customer requirements.
• Make technology decisions on package design, materials, thermal management, reliability, manufacturability, and cost optimization.
• Manage external partnerships with OSATs, assembly partners, material suppliers, and ecosystem collaborators; lead joint development activities.
• Engage directly with customers in technical reviews, roadmap discussions, and executive briefings to translate needs into differentiated solutions.
• Coordinate cross-functional teams (process integration, reliability, product engineering, manufacturing, quality, procurement, supply chain) to execute development programs.
• Identify and mitigate technical, schedule, cost, supply chain, and manufacturing risks; report status and recommendations to senior leadership.
• Ensure successful transition of packaging technologies from development into scalable production.
• Perform work in a safe and compliant manner and support Environmental, Health, Safety & Security programs.

Requirements

Must-have technical, leadership, and external engagement capabilities. Education requirements are summarized under "Education Requirements" below.

• 15+ years of hands-on experience in semiconductor or advanced packaging development and industrialization.
• Proven experience leading complex technology-development organizations and multidisciplinary engineering teams.
• Deep knowledge of advanced packaging technologies, including flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects, thermal management, and reliability qualification.
• Experience working directly with OSATs, outsourced manufacturing partners, and semiconductor supply chains.
• Proven ability to lead strategic customer engagements, external partnerships, and executive-level technical presentations.
• Demonstrated program execution skills across design, manufacturing readiness, qualification, and supply-chain alignment.
• Strong communication, leadership, and stakeholder-management skills.

Nice-to-have:

• Experience with silicon photonics, optical engines, optical interconnects, or co-packaged optics.
• Experience supporting hyperscale, networking, telecommunications, AI, or datacenter applications.
• Track record of building and scaling high-performing engineering organizations and managing technology roadmaps.

Education Requirements

BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related technical discipline.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.