Director, Package Materials Integration (APTD)

Job Title

Director, Package Materials Integration (APTD)

Role Summary

Lead strategy and execution for advanced packaging materials for 3D memory products (e.g., HBM, 3DS DRAM). Manage a distributed team with direct reports in the U.S. and Asia and partner with process development, process integration, equipment development, manufacturing, quality, and purchasing to deliver materials that meet product requirements and timelines.

Responsible for setting the materials roadmap, driving supplier engagement and certification, leading materials aspects of program execution, and resolving critical materials-package interaction issues.

Experience Level

Senior — requires 15+ years of relevant semiconductor or related industry experience and 10+ years of management/leadership experience in packaging technology development.

Responsibilities

Key accountabilities include roadmap ownership, team leadership, supplier engagement, and materials integration across programs.

• Define and lead the advanced packaging materials roadmap and align it to product program timelines.
• Provide technical and interpersonal leadership for a diverse materials portfolio (plating, cleaning chemistries, photoresists, films, polymer composites, carrier materials).
• Engage suppliers at executive and engineering levels to prototype, develop, and certify materials to program requirements.
• Build and lead a high-performing distributed team across the U.S. and Asia, set priorities, and drive talent development.
• Partner with process engineering, equipment development, and integration teams to ensure aligned regional priorities and decision-making.
• Drive materials characterization strategies using analytical, mechanical, and thermal testing to understand materials-package interaction mechanisms and translate findings into decisions.
• Lead materials aspects of program execution and resolve critical materials-package interaction issues.
• Use AI tools to improve processes and materials development workflows.

Requirements

Must-have technical leadership and hands-on advanced packaging experience; proven supplier and cross-functional execution capability.

• 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in advanced packaging.
• 10+ years of management/leadership experience leading global teams and driving execution across regions.
• Proven success leading technical organizations and structured problem solving.
• Working knowledge of 2.5D/3D heterogeneous integration technologies (WLFO, SoIC, CoWoS, WoW, InFO, chiplet/SiP architectures).
• Experience with materials used throughout the advanced packaging flow and with materials suppliers in the packaging ecosystem.
• Working knowledge of materials characterization techniques and simulation (thermal, mechanical, electrical).
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle.
• Excellent communication skills for conveying complex technical concepts to technical and non-technical stakeholders.

Education Requirements

Master of Science or PhD in Chemistry, Chemical Engineering, or Materials Science and Engineering required; PhD preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.