Director, Package Materials Integration (APTD)

Job Title

Director, Package Materials Integration (APTD)

Role Summary

Lead Micron's advanced packaging materials strategy and execution for 3D memory products (including HBM and 3DS DRAM). Manage a distributed, cross-regional team and coordinate with process development, equipment, manufacturing, quality, and purchasing to deliver materials solutions that meet product roadmaps and manufacturing requirements.

Experience Level

Senior — requires extensive technical and leadership experience (see Requirements). This role expects 15+ years of relevant semiconductor or related industry experience and 10+ years of management/leadership in packaging technology development.

Responsibilities

Accountable for defining and delivering the advanced packaging materials roadmap and ensuring materials readiness across programs and regions.

• Set and align the advanced packaging materials roadmap with product development timelines across multiple programs.
• Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials to program requirements and schedules.
• Build and lead a high-performing distributed team across the U.S. and Asia, including talent development and performance management.
• Partner with process engineering, equipment development, and process integration teams to align priorities and decisions across regions.
• Drive materials characterization and analysis (analytical, mechanical, thermal) to understand materials-package interactions and translate findings into product decisions.
• Resolve critical materials-package interaction issues and risks during development and productization.
• Oversee materials aspects of program execution, BOM selection, testing, and qualification for package assembly and substrate technologies.
• Use data and AI-driven approaches to improve materials development and integration processes.

Requirements

Must-have technical and leadership qualifications for immediate impact.

• 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in advanced packaging.
• 10+ years of management/leadership experience in packaging technology development, including leading global teams and driving cross-region execution.
• Practical experience with 2.5D/3D heterogeneous integration technologies (e.g., WLFO, SoIC, CoWoS, WoW, InFO) and chiplet/SiP architectures.
• Working knowledge of materials used across the advanced packaging flow (plating, cleaning chemistries, photoresists, films, polymer composites, carrier materials, etc.).
• Experience working with materials suppliers in the advanced packaging supply chain.
• Working knowledge of materials characterization techniques and simulation methods (thermal, mechanical, electrical).
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle.
• Demonstrated structured problem-solving skills and excellent communication for technical and non-technical stakeholders.

Education Requirements

Master of Science or PhD in Chemistry, Chemical Engineering, or Materials Science and Engineering; PhD preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.