Director, Package Materials Integration — Advanced Packaging Technology Development (APTD)

Job Title

Director, Package Materials Integration — Advanced Packaging Technology Development (APTD)

Role Summary

Lead the strategy, execution, and organizational capability for Micron's advanced packaging materials roadmap for advanced 3D memory products (e.g., HBM, 3DS DRAM). Manage a global team with direct reports in the U.S. and Asia and partner with process development, integration, equipment, manufacturing, quality, and purchasing to deliver qualified materials and resolve materials-package interaction issues.

Experience Level

Senior — typically requires 15+ years of relevant experience in semiconductor manufacturing or a related field and 10+ years of management/leadership experience overseeing global teams and driving cross-functional execution.

Responsibilities

Lead materials roadmap and program execution; engage suppliers and cross-functional partners to develop and qualify materials for advanced packaging.

• Define and maintain the advanced packaging materials roadmap aligned to product timelines across multiple development programs.
• Provide leadership for a diverse materials portfolio (plating, cleaning chemistries, photoresists, films, polymer composites, carrier materials).
• Engage suppliers at executive and engineering levels to prototype, develop, and certify materials to program requirements and timelines.
• Build and lead a high-performing global team, set priorities, and drive talent development and execution discipline.
• Partner with process engineering, equipment development, and process integration to meet technical deliverables and align regional decision-making.
• Drive materials characterization strategies and translate analytical, mechanical, and thermal testing into product decisions.
• Develop novel materials solutions in collaboration with packaging and product teams to meet electrical, mechanical, thermal, reliability, cost, and system requirements.
• Lead materials aspects from pathfinding through development and into high-volume manufacturing, resolving critical materials-package interaction issues.

Requirements

Must-have technical and leadership qualifications for successful performance in this role.

• Demonstrated success leading technical organizations and applying structured problem-solving.
• Working knowledge of 2.5D/3D heterogeneous integration technologies (e.g., WLFO, SoIC, CoWoS, WoW, InFO) and chiplet/SiP architectures.
• Practical experience with materials used across the advanced packaging flow and with materials suppliers in the packaging ecosystem.
• Familiarity with materials characterization techniques and simulation methodologies (thermal, mechanical, electrical).
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle.
• Proven program and organizational leadership: driving cross-functional technical teams, influencing executives, and delivering through others.
• Excellent communication skills for technical and non-technical audiences and proven people leadership managing managers and senior technical leaders across geographies.
• Strong understanding of semiconductor process integration and process development.
• Ability to lead supplier engagement and certification efforts for materials aligned to program needs.
• Nice-to-have: direct experience with advanced memory packaging technologies.

Education Requirements

Master of Science (MS) or PhD in chemistry, chemical engineering, or materials science and engineering; PhD preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.