Director, HBM RTL Design and Integration
Micron TechnologyJob Title
Director, HBM RTL Design and Integration
Role Summary
Lead a multi-disciplinary engineering team responsible for RTL design, IP integration, and SoC-level integration for HBM logic dies. Drive technical strategy, design methodology, and cross-functional execution across multiple product generations.
Work closely with architecture, verification, physical design, firmware, product engineering, and manufacturing teams to deliver manufacturable, high-performance HBM SoC solutions.
Experience Level
Senior — technical leadership role. Preferred: 15+ years of relevant SoC design and management experience.
Responsibilities
Own RTL design and SoC integration activities and scale the RTL organization to meet program goals.
- Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning and IP integration.
- Translate architectural and micro-architectural specifications into high-quality RTL implementations.
- Oversee clocking, reset, power intent, configuration infrastructure, and system-level design correctness.
- Establish design methodologies and best practices to improve quality, reuse, and development efficiency.
- Coordinate with Architecture, Verification, Physical Design, Firmware, Product Engineering, Test, Process Integration, Assembly, and Manufacturing.
- Drive trade-offs among performance, power, area, schedule, and risk.
- Recruit, mentor, and retain a high-performing RTL design and integration team.
Requirements
Must-have technical and leadership qualifications required to perform the role; preferred items noted separately.
- Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes.
- Deep expertise in RTL design and SoC integration across RTL-to-GDS flows, including synthesis, timing, and signoff considerations.
- Experience integrating complex IP subsystems (controllers, NOC, microcontrollers, PHY-adjacent logic, RAS, MBIST, interfaces).
- Familiarity with SystemVerilog and EDA toolflows; scripting experience (Python, TCL) for automation and flows.
- Demonstrated ability to drive cross-functional programs and trade-off technical priorities (performance, power, area, schedule, risk).
Nice-to-have / preferred
- Knowledge of DRAM/HBM systems and JEDEC standards.
- Track record of multiple tape-outs and delivering programs end-to-end.
- Experience building and managing global engineering teams.
- 15+ years of relevant SoC design experience with increasing technical leadership scope.
Education Requirements
Not specified.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
