Director, APTD Die Level Technology Process Development

Job Title

Director, APTD Die Level Technology Process Development

Role Summary

Lead strategy and execution for die‑level and wafer‑level advanced packaging process development for Micron's advanced memory products (e.g., HBM, 3DS DRAM, 3D architectures). Partner with R&D, suppliers, and manufacturing to develop, qualify, and transfer novel process flows and materials into production.

Experience Level

Senior - typically requires 15+ years in semiconductor process development, manufacturing, or advanced packaging.

Responsibilities

Drive end‑to‑end process development, cross‑functional programs, and supplier engagement to achieve manufacturing readiness for advanced packaging technologies.

• Own process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness.
• Develop and mature process flows, materials, and integration schemes to meet electrical, mechanical, thermal, cost, and reliability targets.
• Lead first‑of‑a‑kind (FOAK) development, supplier engagement, and ecosystem collaboration to close capability gaps.
• Drive structured problem solving and guide strategic technical decisions across programs.
• Lead technology transfer to manufacturing and influence packaging/integration roadmaps across product teams.
• Apply automation, data analytics, modeling, and AI‑enabled tools to accelerate development and improve decision making.

Requirements

Key must‑have technical skills and leadership experience for this role. Education requirements are listed separately below.

• Must have: 15+ years of experience in semiconductor process development, manufacturing, or advanced packaging.
• Must have: Deep practical expertise in wafer‑level and die‑level processes (examples: CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, molding).
• Must have: Strong understanding of process integration and materials interactions.
• Must have: Proven experience leading complex, cross‑functional technical programs and transferring technology to manufacturing.
• Must have: Experience using data analytics, automation, or modeling tools to support development decisions.
• Nice to have: Extensive experience with advanced memory technologies or 3D packaging architectures.
• Nice to have: Experience mentoring engineers and improving technical methodology.
• Nice to have: Familiarity with materials characterization and simulation (thermal, mechanical, electrical).

Education Requirements

Minimum: MS in Chemistry, Chemical Engineering, Materials Science, or a related technical field, or equivalent practical experience. Preferred: PhD in a relevant technical field. (Fields noted: Chemistry, Chemical Engineering, Materials Science, related technical disciplines; equivalent experience acceptable.)

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.