Director, Advanced Power Silicon & Packaging Technology

Job Title

Director, Advanced Power Silicon & Packaging Technology

Role Summary

Lead strategy, architecture, development, and deployment of next-generation power delivery technologies across silicon, packaging, and system integration for AI, datacenter, networking, and high-performance computing platforms.

Partner with silicon design, packaging, manufacturing, and product teams to deliver improvements in power efficiency, power density, performance, reliability, and total cost of ownership.

Experience Level

Senior - 15+ years in semiconductor and power technology; 6+ years leading technology, architecture, or engineering organizations.

Responsibilities

Accountable for technology roadmaps, cross-functional execution, research incubation, and building organizational capability.

• Define and execute roadmaps for advanced power silicon, advanced packaging, chip-package-system co-design, and vertical power delivery solutions.
• Identify disruptive technologies and assess strategic investment opportunities to drive competitive advantage.
• Drive adoption and optimization of power semiconductor technologies (GaN, SiC, advanced CMOS/BCD) to improve efficiency, die area, and reliability.
• Establish packaging roadmaps (2.5D/3D, chiplets, interposers, fan-out, embedded power, co-packaged solutions) and lead electrical, thermal, and mechanical optimization.
• Lead cross-functional initiatives to optimize power integrity (PI), signal integrity (SI), thermal performance, electromigration reliability, and power delivery networks (PDN).
• Lead advanced technology incubation, proofs-of-concept, and partnerships with foundries, OSATs, EDA vendors, and research institutions.
• Create and manage IP portfolios, drive patent generation and technical publications.
• Mentor senior technical leaders and develop organizational capability; promote technical rigor and execution excellence.

Requirements

Must-have technical leadership, domain expertise, and a proven record of delivering silicon and packaging technologies into production.

• 15+ years of experience in semiconductor and power technologies.
• 6+ years leading technology, architecture, or engineering organizations.
• Proven success delivering innovative silicon and packaging technologies from concept through production.
• Expertise in power semiconductor devices and power integrity analysis.
• Experience with advanced packaging: chiplet integration, 2.5D/3D packaging, fan-out technologies, silicon interposers, and package reliability/qualification.
• Systems knowledge of power delivery networks, thermal management, manufacturing, and supply chain considerations.
• Track record of driving technology differentiation, patents, and strategic partnerships with foundries/OSATs/EDA vendors.
• Ability to lead cross-functional technical programs and mentor senior engineers.

Nice-to-have:

• Experience with vertical power delivery, backside power distribution networks, or embedded voltage regulation.
• Participation or recognition in standards/industry organizations (IEEE, OCP, JEDEC).

Education Requirements

BS in Electrical Engineering, Physics, Materials Science, or a related discipline required; MS or PhD preferred.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.