Director, Advanced Packaging Technology Development

Job Title

Director, Advanced Packaging Technology Development

Role Summary

Provide strategic and technical leadership for development and deployment of advanced packaging assembly processes for next-generation memory products. Lead a global team to define technology roadmaps, develop scalable and manufacturable processes, and transfer qualified technologies to high-volume manufacturing.

Experience Level

Senior - minimum 12 years of semiconductor industry experience, including at least 5 years in advanced packaging technology development and a minimum of 5 years of leadership experience managing managers or large technical organizations.

Responsibilities

Accountable for technology strategy, process development, manufacturing readiness, cross-functional collaboration, and organizational capability.

• Define and communicate advanced packaging technology strategies and process roadmaps aligned to product plans.
• Evaluate emerging assembly technologies, materials, and equipment and recommend investments based on technical and business impact.
• Lead process development from concept through qualification, productization, and transfer to high-volume manufacturing.
• Drive innovation in die attach, hybrid bonding, thermocompression bonding, molding, underfill, substrate assembly, singulation, and related processes.
• Establish scalable, manufacturable process architectures that balance performance, cost, reliability, and cycle time.
• Partner with Process Integration, Design, Product Engineering, Reliability, Manufacturing, Procurement, Quality, and Supply Chain to resolve technical issues and enable product launches.
• Develop supplier partnerships and lead co-development with equipment and material vendors.
• Set performance metrics, drive continuous improvement, and report key indicators to senior leadership.
• Build and mentor technical leaders, manage succession planning, and develop organizational capability.
• Promote data-driven decision making and adoption of advanced analytics and AI-enabled process optimization.

Requirements

Must-have:

• Minimum 12 years of semiconductor industry experience with at least 5 years focused on advanced packaging technology development.
• Minimum 5 years of leadership experience managing managers and/or large technical organizations.
• Proven track record developing and qualifying advanced packaging technologies from concept to manufacturing transfer.
• Technical expertise in one or more areas: 2.5D/3D packaging, hybrid bonding (D2W/W2W/C2W), HBM and heterogeneous integration, wafer-level and fan-out packaging, assembly materials and processes, reliability engineering, process control, yield improvement, and failure analysis.
• Strong data and analytical skills; experience with tools such as JMP, Python, R, SQL or equivalent; familiarity with process capability, SPC, and DOE.
• Demonstrated ability to influence cross-functional and external stakeholders and to lead execution under ambiguity and tight timelines.
• Excellent verbal, written, and executive presentation skills.

Nice-to-have:

• Experience with supplier co-development, capital/equipment investment planning, and global technology transfer.
• Experience applying AI, advanced analytics, or intelligent manufacturing methods to process optimization.
• Specific experience enabling HBM and next-generation 3D packaging platforms.

Education Requirements

MS or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Chemistry, Computer Engineering, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.