Director, Advanced Package Assembly & Test Engineering — Taiwan (Supplier Development)

Job Title

Director, Advanced Package Assembly & Test Engineering — Taiwan (Supplier Development)

Role Summary

Lead a Taiwan-based supplier-development engineering team (5–6 engineers) focused on advanced package assembly and test. Act as the primary technical and execution interface with OSAT suppliers to drive development, qualification, yield improvement, failure analysis, and manufacturing readiness for advanced packaging programs.

Experience Level

Senior — requires 15+ years of experience in semiconductor packaging, assembly, test, supplier engineering, or related advanced manufacturing roles.

Responsibilities

Primary responsibilities include building the local team, driving supplier execution, and ensuring NPI and production readiness.

• Recruit, hire, coach, and retain a Taiwan-based team of ~5–6 advanced packaging, assembly, test, and supplier engineers.
• Act as senior technical and operational liaison onsite at the supplier; manage day-to-day engineering alignment, issue resolution, and supplier accountability.
• Lead assembly and test development across package architecture, process integration, NPI, qualification, reliability, and production ramp.
• Establish engineering operating mechanisms with suppliers: technical reviews, milestone tracking, risk management, and clear escalation paths.
• Drive rapid learning cycles to reduce cycle time, improve yield, and resolve quality issues.
• Lead root-cause analysis and corrective actions using structured failure analysis and 8D methodologies.
• Coordinate cross-functionally with product line, technology development, design, test, quality, reliability, procurement, and program management.
• Represent engineering leadership in supplier reviews, executive updates, and customer program discussions.

Requirements

Must-have technical and leadership qualifications, followed by concise preferred skills.

• 15+ years of relevant experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related roles.
• Proven leadership managing engineering teams and recruiting technical talent in Taiwan or the Asia semiconductor ecosystem.
• Hands-on technical expertise in advanced package assembly and test processes (examples: WLCSP, fan-out WLP, TSV, flip chip, Cu pillar, micro-bump, die attach, substrate-based packages, heterogeneous integration).
• Direct experience working with OSAT suppliers in Taiwan and demonstrated ability to influence supplier priorities, engineering discipline, technical execution, and schedule performance.
• Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, and manufacturing ramp support.
• Strong communication skills in English; Mandarin Chinese capability strongly preferred for supplier engagement and local recruiting.
• (Nice-to-have) Prior leadership at or close partnership with ASE, major OSAT, IDM, fabless company, or foundry with advanced packaging programs.
• (Nice-to-have) Experience building a technical team from the ground up and supporting high-priority schedule recovery or supplier-acceleration programs.
• (Nice-to-have) Familiarity with optical engine, silicon photonics, co-packaged optics, AI infrastructure, or high-speed interconnect programs.

Education Requirements

Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field required; advanced degree preferred.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.