Dir, Package Design Engineering

Job Title

Director, Package Design Engineering

Role Summary

Lead and operate Assembly Engineering for Renesas' Japan (PAE1) and Malaysia (PAE3) groups based in Taichung, responsible for transitioning qualified packages to mass production and ensuring production quality, yield, cost and delivery.

The role coordinates with Package Development (NPI), Supply Chain, Procurement, OSATs, and QA to resolve capacity, material, quality and RMA issues and to define OSAT and substrate strategies.

Experience Level

Senior — 15+ years of assembly/packaging engineering experience, with leadership of multi-site assembly operations.

Responsibilities

Provide technical and operational leadership for assembly engineering and production ramp of packaged products.

• Manage Japan Assembly Engineering (PAE1) and Malaysia Assembly Engineering (PAE3) groups.
• Take over qualified products from NPI and drive stable mass production handoff.
• Coordinate with Supply Chain Management and Procurement to resolve capacity and material supply issues and secure on-time delivery.
• Work with OSATs and QA to investigate and resolve assembly-related quality issues and customer RMAs.
• Define OSAT strategy and perform industry benchmarking of substrate, material, and equipment suppliers.
• Perform competitive analysis and literature surveys to inform packaging decisions.
• Manage Product Change Notices (PCN) and Product Discontinuation Notices (PDN) related to assembly.
• Publish regular assembly engineering statistics and lead action plans for yield improvement, cost reduction, cycle-time reduction, and continuous improvement.

Requirements

Must-have technical and leadership qualifications to run multi-site assembly engineering for automotive and industrial products.

• Must-have: 15+ years assembly engineering experience (high-volume semiconductor packaging).
• Must-have: Proven OSAT management experience and vendor strategy development.
• Must-have: Automotive packaging experience and familiarity with automotive qualification requirements.
• Must-have: Hands-on assembly experience with package types such as FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.
• Must-have: Substrate experience including MSAP, ETS, Tenting, and ABF substrates.
• Must-have: SMT process knowledge, warpage control, and board-level reliability (BLR) testing experience.
• Must-have: Strong communication, documentation, and schedule management skills.
• Must-have: Familiarity with industry standards such as JEDEC and IPC.
• Nice-to-have: Experience with supply-chain coordination for capacity/material planning and PCN/PDN workflows.

Education Requirements

MS or Ph.D. in Materials Science or Mechanical Engineering (as stated). No alternative-equivalence language provided.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.