Digital Design Engineer

Job Title

Digital Design Engineer

Role Summary

Design and verify digital RTL for co‑packaged optical modules and related subsystems within the CPO product. Work with architecture, analog/mixed‑signal, photonics, and physical design teams to integrate digital IP into top‑level SoCs and support tape‑out and post‑silicon bring‑up.

Experience Level

Entry-level. The posting requests approximately 1+ years of relevant digital RTL design experience.

Responsibilities

Key responsibilities include:

• Develop, document, and maintain RTL (SystemVerilog/Verilog) for digital subsystems: control logic, register interfaces, link management, and DFT structures.
• Define digital interfaces and control schemes in collaboration with architecture, analog/mixed‑signal, and photonics teams.
• Create micro‑architecture specs, participate in design reviews, and integrate digital IP into the top‑level SoC.
• Drive synthesis, timing closure, CDC analysis, linting, and low‑power (UPF) sign‑off with the physical design team.
• Perform FPGA prototyping and validation to accelerate pre‑silicon bring‑up and de‑risk RTL before tape‑out.
• Develop and execute UVM‑based verification: reusable verification components, constrained‑random tests, and coverage closure.
• Support DV testbench development, debug, and gate‑level simulation; participate in ECO planning and post‑silicon bring‑up.
• Contribute to design methodology, reuse strategy, and quality improvements across the team.

Requirements

Must‑have technical skills and experience:

• 1+ years of hands‑on RTL design experience using SystemVerilog/Verilog.
• Solid understanding of synchronous digital design, CDC, FSMs, pipelining, and low‑power design concepts.
• Practical experience with industry EDA tools for synthesis, simulation, lint, and CDC analysis.
• Scripting proficiency for design automation (Python, TCL, Perl or similar).
• Experience with FPGA prototyping and functional verification (UVM, testbench development, coverage-driven verification).
• Strong problem‑solving skills and ability to work in cross‑functional teams.

Nice‑to‑have:

• Experience with high‑speed serial interfaces (SerDes, PCIe, Ethernet, CXL) or optical link control.
• Exposure to silicon photonics, co‑packaged optics, or advanced packaging.
• ARM SoC integration experience and familiarity with AMBA protocols (AXI/AHB/APB).
• Prior tape‑out experience and knowledge of UPF/low‑power flows and DFT (scan, MBIST, boundary scan).

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field. (Degree is specified by the posting.)

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.