Die / Clip Attach Technical Expert
NexperiaJob Title
Die / Clip Attach Technical Expert
Role Summary
Responsible for developing and implementing technical solutions across semiconductor assembly processes (Pre-Assembly, Die Bond, Wire Bond, Mold and related areas). The role drives equipment strategy, introduces advanced technologies, resolves complex manufacturing issues, and improves cost, quality and capability.
Works closely with cross-functional and international teams to support factory objectives and future package R&D roadmaps.
Experience Level
Senior — minimum 10 years of experience in semiconductor manufacturing and process engineering.
Responsibilities
Primary responsibilities include equipment strategy, process improvement, benchmarking, project leadership, and collaboration with R&D and production teams.
- Define and drive equipment strategies aligned with factory and package R&D roadmaps.
- Evaluate and select new equipment technologies for manufacturing processes.
- Lead equipment introduction and qualification projects.
- Solve complex and chronic technical issues in manufacturing.
- Drive improvement projects to enhance productivity, process capability, quality, and cost efficiency.
- Develop and maintain process standards and design rules.
- Conduct cross-site benchmarking and implement best practices.
- Scout and evaluate state-of-the-art technologies and industry solutions.
- Lead technical projects involving cross-functional and international teams; prepare technical reports, capability studies and roadmaps.
- Collaborate closely with R&D, production, quality, and engineering teams and maintain supplier/technology partner relationships.
Requirements
Must-have skills and experience for successful performance in this role.
- Minimum 10 years' experience in semiconductor manufacturing and process engineering.
- Strong technical expertise in process and/or equipment engineering within semiconductor assembly operations.
- Proven experience in equipment selection, qualification, optimization, and technology introduction.
- Strong analytical thinking, troubleshooting and problem-solving capabilities.
- Experience leading technical and cross-functional projects in a manufacturing environment.
- Ability to work independently and proactively drive improvement initiatives.
- Strong communication and presentation skills; effective stakeholder engagement.
- Leadership, influencing skills and stakeholder management.
- Detail-oriented with a structured and systematic working approach.
Education Requirements
Bachelor's or masters degree in engineering or a related discipline.
About the Company
Company: Nexperia
Headquarters: Cabuyao, Philippines
Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.
