Job Title
Die / Clip Attach Technical Expert
Role Summary
Develop and implement technical solutions for semiconductor assembly processes including Pre-Assembly, Die Bond, Wire Bond, Mold and Clip Attach. Drive equipment strategy and technology introduction to improve manufacturing cost, quality and capability while supporting factory objectives and package R&D roadmaps.
Experience Level
Senior β minimum 10 years of relevant semiconductor manufacturing and process engineering experience.
Responsibilities
Primary responsibilities focus on equipment strategy, process improvement, technology scouting and cross-functional project leadership.
- Define and drive equipment strategies aligned with factory and package R&D roadmaps.
- Evaluate, select, introduce and qualify new equipment technologies for assembly processes.
- Troubleshoot and resolve complex or chronic manufacturing issues.
- Lead improvement projects to increase productivity, process capability, quality and cost efficiency.
- Develop and maintain process standards and design rules.
- Conduct cross-site benchmarking and implement best practices across sites.
- Scout and evaluate state-of-the-art technologies and supplier solutions.
- Lead technical projects with cross-functional and international teams; prepare technical reports, capability studies and roadmaps.
- Collaborate closely with R&D, production, quality and engineering teams.
Requirements
Must-have skills and experience for this role; concise and outcome-focused.
- Minimum 10 years' experience in semiconductor manufacturing and process engineering.
- Strong technical expertise in process and/or equipment engineering within assembly operations (Die Bond, Wire Bond, Mold, Clip Attach, Pre-Assembly).
- Proven experience in equipment selection, qualification, optimization and technology introduction.
- Strong analytical, troubleshooting and problem-solving capabilities.
- Experience leading technical and cross-functional projects in a manufacturing environment.
- Strong communication, presentation, stakeholder management and influencing skills.
- Detail-oriented with a structured and systematic working approach.
Education Requirements
Bachelor's or Masters degree in engineering or a related discipline (specified in the source). No certifications or equivalent-experience clauses were listed.
About the Company
Company: Nexperia
Headquarters: Cabuyao, Philippines
Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.

Date Posted: 2026-08-06