Device Modeling & Characterization Engineer

Job Title

Device Modeling & Characterization Engineer

Role Summary

Develop compact (SPICE) device models and perform device characterization for FDSOI, FinFET and Bulk MOSFET technologies as part of the Ultra-Low-Power CMOS modeling team in Bengaluru. Deliver model extraction, model-to-hardware correlation and statistical models used in Process Design Kits (PDKs) for digital, analog and RF applications.

The role includes hands-on modeling and measurement analysis, cross-functional collaboration with device and process engineers, and leadership of strategic modeling projects.

Experience Level

Senior — position expects substantial industry experience; see Education Requirements for degree and years guidance.

Responsibilities

Core responsibilities include development, validation and delivery of compact models and characterization data.

• Design MOSFET characterization structures and plan measurements for compact model extraction.
• Develop and calibrate compact models for FDSOI, FinFET and Bulk technologies; extend models to MRAM and RRAM where applicable.
• Perform device measurement analysis applying semiconductor physics to interpret data and debug measurement or device issues.
• Develop statistical models (Monte Carlo, mismatch, fixed corners) and perform model-to-hardware correlation, K and CpK analysis.
• Prepare technical reports and recommendations based on characterization and modeling results.
• Lead and coordinate cross-functional projects across sites; coach and mentor team members.
• Support Environmental, Health, Safety & Security requirements during all activities.

Requirements

Key technical and professional requirements. Education degree details are listed under Education Requirements below.

• Must-have: Strong semiconductor device physics knowledge, especially MOSFET behavior and characterization.
• Must-have: Demonstrated experience in compact (SPICE) model development and model extraction workflows.
• Must-have: Hands-on experience with device measurements, test-structure design and characterization data analysis.
• Must-have: Experience producing model-to-hardware correlation and statistical model analyses.
• Must-have: Ability to lead technical projects, work cross-functionally, and communicate technical results clearly.
• Nice-to-have: Experience with FDSOI and FinFET specifics, BSIM-family models, model extraction tools (e.g., MBP/ICCAP) and RF characterization of MOSFETs.
• Nice-to-have: Experience with non-volatile device modeling (MRAM, RRAM) and process-development measurement experience.

Education Requirements

PhD in Electrical/Electronics or Device Engineering with 8+ years of relevant experience, or Master’s in Electrical/Electronics Engineering with 12+ years of relevant experience. Fields referenced include semiconductor physics and microelectronics. Preferred qualification: PhD in Electrical/Electronics or Device Engineering.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.