Device Engineering Intern (Jan–Jun 2027)
Join the 55nm RRAM development team to support device characterization, SPICE model development, and electrical data analysis for embedded non-volatile memory applications. The role combines hands-on wafer/bench measurements with simulation and data correlation under the guidance of device engineers.
Entry-level internship for current university students (no specific professional experience required).
Primary duties include hands-on measurements, simulation, analysis, and reporting:
Must-have qualifications and commitments:
Preferred:
Actively pursuing a Bachelor's, Master's, or PhD in Electrical/Electronic Engineering, Microelectronics, Physics, or a related technical field. Internship should be credit-bearing (16–24 weeks) and commence January 2027.
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
