Device Engineering Intern (Jan-Jun 2027)
Summer/semester internship on the 55nm RRAM device-development team in Singapore (Woodlands). The intern will perform device characterization, electrical measurements, SPICE simulations, and data analysis to support RRAM bitcell evaluation and model development for embedded non-volatile memory applications.
Entry-level (student internship). Intended for current undergraduate or graduate students pursuing a technical degree.
The intern will work under device engineering mentorship to evaluate RRAM performance and support model validation.
Must-have items for eligible applicants.
Actively pursuing a Bachelor's, Master's, or PhD in Electrical/Electronic Engineering, Microelectronics, Physics, or a related technical field. Enrollment must allow a 16β24 week credit-bearing internship (January 2027). "Good academic standing" is required.
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
