Device Engineering Intern (Jan–Jun 2027)
GlobalFoundriesJob Title
Device Engineering Intern (Jan–Jun 2027)
Role Summary
Join the 55nm RRAM (Resistive Random Access Memory) development team to support device characterization, SPICE modeling, and data analysis for embedded non-volatile memory applications. The role is a hands-on engineering internship based in Woodlands, Singapore.
The intern will work with device engineers to run electrical measurements, validate models, correlate silicon results with simulation, and produce technical reports.
Experience Level
Entry-level internship. Intended for students currently enrolled in undergraduate or graduate engineering/science programs.
Responsibilities
Key responsibilities include laboratory measurements, simulation support, and analysis.
- Characterize RRAM bitcells using wafer-level and bench electrical measurements.
- Perform SPICE simulations and validate RRAM models against data.
- Analyze electrical data including switching performance, endurance, and retention.
- Correlate silicon measurement results with simulation and modeling outputs.
- Support device debugging, data analysis, and prepare technical reports.
- Perform work according to Environmental, Health, Safety & Security requirements.
Requirements
Must-have operational requirements and preferred skills.
- Ability to work at least 40 hours per week for the internship period.
- Available for the internship period commencing January 2027.
- Must adhere to safety and EHS protocols while working in lab/wafer environments.
Preferred (nice-to-have):
- Prior related internship or co-op experience in semiconductor/device testing.
- Basic knowledge of semiconductor devices and circuits.
- Familiarity with SPICE simulation tools and model validation.
- Programming skills such as Python for data analysis.
- Strong analytical and problem-solving skills.
Education Requirements
Actively pursuing a Bachelor's, Master's, or PhD in Electrical/Electronic Engineering, Microelectronics, Physics, or a related technical field. Must be in good academic standing. Internship is expected to be a 16–24 week credit-bearing placement commencing January 2027.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
