Device Engineer

Job Title

Device Engineer

Role Summary

Join the Intel Ireland Device Engineering (Yield) team to develop and optimize advanced FinFET device technology for high-volume manufacturing (HVM). The role partners with Integration, Module, Yield and Technology Development teams to drive yield ramp-up, device performance and process optimization for internal and foundry customers.

Experience Level

Mid-level. Typical candidates have 5–10 years of experience in advanced-node semiconductor device engineering, FinFET development, or FEOL/BEOL integration in HVM environments.

Responsibilities

Accountabilities include device performance targeting, yield ramp activities, device/process optimization, and cross-functional problem solving in a production fab.

• Drive factory product power and performance roadmap; participate in Performance TMI team to meet customer specifications.
• Own engineering projects to execute HVM yield roadmap, device targeting and performance targets.
• Collaborate with Technology Development to develop and import new device architectures into production.
• Lead or participate in cross-organizational root-cause analysis for device-related yield and performance issues and define mitigations.
• Own NPI activities in production fabs and perform device-related process optimizations to meet customer requirements.
• Develop models to predict device performance during silicon progression and implement systematic solutions to maintain baseline performance.
• Work with Process Integration to simplify processes and implement cost-reduction opportunities.

Requirements

Required technical experience, core skills, and behavioral competencies.

• 5–10 years' experience in advanced-node semiconductor industry in Device or FEOL/BEOL integration.
• 5–10 years' experience in FinFET technology development or high-volume manufacturing.
• Hands-on application of device physics in a production fab environment.
• Proven problem-solving skills with ability to analyze complex process issues and identify effective solutions.
• Strong teamwork, partnership and communication skills; able to influence across levels.
• Self-motivated, adaptable, and committed to meeting aggressive goals with a strong sense of urgency.

• Experience driving product performance roadmaps with multidisciplinary teams.
• Experience with process transfers to HVM and solving integrated manufacturing issues.
• Experience serving external foundry customers through technical interactions.
• Experience with GAA (Gate-All-Around) technology and new semiconductor technology development.
• Familiarity with module processes: lithography, dry/wet etch, CMP, diffusion, implant, thin films and metrology.

Education Requirements

Relevant Bachelor's, Master's and/or PhD degree in Device Physics, Electronics, Electrical Engineering, Physics, Chemistry, Materials Science or a related technical field. An advanced degree (Master's or PhD) is preferred. Equivalent practical experience in lieu of formal degree is acceptable where demonstrated.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.