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Device Compact Modeling Engineer (2027 New College Graduate)

GlobalFoundries
September 30, 2026
Full-time
On-site
Malta, New York, United States
$58,400 - $100,800 USD yearly
Device Engineering Jobs, Level - Entry or Early Career

Job Title

Device Compact Modeling Engineer - New College Graduate (2027)

Role Summary

Develop compact SPICE device models for digital, analog, and RF CMOS technologies and deliver production-ready, validated models for internal and external customers. Collaborate with characterization, PDK, device engineering, process integration, and design teams to ensure models meet quality and timeline targets.

Experience Level

Entry-level / New college graduate. Role targets recent or upcoming 2027 bachelor's graduates; internship or co-op experience is beneficial but not required.

Responsibilities

Primary responsibilities focus on model development, validation, cross-functional coordination, and customer support.

  • Develop and extract SPICE compact models for digital, analog, and RF devices for GF CMOS technologies.
  • Define and apply data selection, extraction, QA, validation, and circuit benchmarking best practices.
  • Coordinate cross-functional efforts with Device Modeling, Characterization Labs, PDK, Device Engineering, Process Integration, and design/layout teams to execute model projects and resolve issues.
  • Perform model QA, circuit benchmarking, and validation to meet project timelines and quality standards.
  • Provide technical updates to stakeholders and participate in customer engagements and technical support for model-related questions.
  • Monitor industry trends and incorporate advances in SPICE modeling methodologies and tools.
  • Adhere to Environmental, Health, Safety & Security requirements in all work activities.

Requirements

Must-have technical skills and abilities; preferred items are listed as nice-to-have.

  • Fundamental knowledge of semiconductor device physics related to compact modeling.
  • Understanding of device noise and matching behaviors.
  • Familiarity with SPICE-based modeling workflows and circuit benchmarking.
  • Effective written and verbal communication in English.
  • Ability to coordinate cross-functional technical teams and document technical results.
  • Nice-to-have: prior internship or co-op experience; coding skills (Python, Perl, etc.); experience with machine learning/AI; SPICE model generation and QA flow; analog/RF design flow experience; test-structure layout experience; project management and planning skills.

Education Requirements

Graduating with a Bachelor’s degree in Electrical Engineering, Physics, or a related field from an accredited program. Minimum overall GPA of 3.0 and good academic standing required. Role targets new college graduates (2027).


About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

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Date Posted: 2026-09-29