New College Grad - HBM SoC Design Engineer/Architect
Micron TechnologyJob Title
New College Grad - HBM SoC Design Engineer/Architect
Role Summary
Entry-level engineering role on the Heterogeneous Integration Group focused on design, integration, and validation of HBM logic die and memory-centric SoCs. Collaborate with architecture, RTL, verification, physical design, firmware, and product teams to meet power, performance, area, quality, and schedule objectives.
Apply academic coursework, research, internships, and project experience to ASIC digital design, HBM architecture, and automation/AI-enabled engineering workflows.
Experience Level
Entry-level (new college graduate). Suitable for candidates moving from academic work, internships, or engineering projects; no specific professional years required.
Responsibilities
Primary responsibilities include RTL design, subsystem integration, and supporting design-quality activities for next-generation HBM SoC solutions.
- Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog.
- Collaborate with architects and cross-functional teams to translate functional requirements into microarchitectures and interface definitions.
- Support simulation, synthesis, static timing analysis (STA), clock-domain crossing (CDC) analysis, debugging, and design reviews.
- Evaluate power, performance, area, and timing tradeoffs and produce data-driven technical recommendations.
- Develop automation and leverage AI-assisted workflows (Generative AI, LLMs, agentic AI) to improve engineering productivity and verification efficiency.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- Academic, research, internship, or project experience in digital design, ASIC development, FPGA design, computer architecture, or related disciplines.
- Working knowledge of Verilog, SystemVerilog, VHDL, or another hardware description language.
- Understanding of digital design fundamentals: finite-state machines, pipelining, clocking and reset strategies, timing concepts, and synchronous logic.
- Familiarity with simulation, synthesis, static timing analysis, CDC analysis, debugging, and participating in design reviews.
- Strong analytical and problem-solving skills and effective written and verbal communication for collaborative engineering work.
Preferred / nice-to-have
- Familiarity with formal verification, UVM, FPGA prototyping, or industry-standard EDA tools.
- Understanding of memory systems and high-speed interfaces such as HBM, DDR, LPDDR, PCIe, or CXL.
- Experience applying automation or AI-enabled development tools (Generative AI, LLMs, AI assistants) to semiconductor design, validation, or engineering workflows.
Education Requirements
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field is required and must be completed prior to employment start date. Master's or Ph.D. in Electrical Engineering, Computer Engineering, or a related discipline is preferred. The role also expects relevant academic, research, internship, or project experience in semiconductor/digital design domains.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
