Design Lead (HBM/Advanced Memory Design)

Job Title

Design Lead (HBM/Advanced Memory Design)

Role Summary

Lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. Coordinate cross-functional teams (Design, Verification, Layout, CAD, Product Engineering, Technology Development) to deliver high-quality silicon on aggressive schedules.

Experience Level

Senior - typically requires 8+ years of semiconductor design experience.

Responsibilities

Provide technical leadership across design, integration, and silicon bring-up.

• Lead design and execution of complex memory subsystems and top-level integration.
• Own design planning, technical decisions, risk assessment, and schedule execution.
• Coordinate with architecture, verification, layout, DFT, and product engineering to ensure manufacturability and quality.
• Review design specifications, microarchitecture, and implementation plans; lead design reviews.
• Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities as needed.
• Support silicon bring-up, debug, characterization, and yield improvement.
• Mentor junior engineers and provide project-level technical leadership.
• Define and improve design methodologies, including automation and AI-enabled tools.
• Communicate project status, risks, and mitigation plans to stakeholders and management.

Requirements

Must-have skills and experience.

• 8+ years of semiconductor design experience with demonstrated leadership of complex IC development programs.
• Strong understanding of digital and/or custom circuit design methodologies.
• RTL design experience (Verilog/SystemVerilog).
• Timing closure and physical implementation experience.
• Experience with verification, debug flows, DFT, and silicon validation.
• Power, performance, and area optimization experience.
• Experience supporting silicon bring-up, debug, characterization, and yield improvement.
• Strong communication, leadership, and project management skills.

Nice-to-have:

• Experience with DRAM technologies (DDR, HBM, LPDDR) and advanced memory products.
• Experience leading global cross-functional teams and successful product tape-outs.
• Knowledge of advanced process nodes, DFM, and package integration (2.5D/3D stacking, TSV).
• Familiarity with Synopsys and Cadence implementation flows.

Education Requirements

BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.