Design Engineering Intern

Job Title

Design Engineering Intern

Role Summary

The Design Engineering Intern will support RF and package design activities, focusing on low-cost, thermally efficient packaging and RF power amplifier (PA) design. The role combines simulation, lab measurement, test-plan execution, and collaboration with technicians and cross-functional teams.

Work includes validating simulated data with lab measurements, developing mechanical robustness tests for packages, creating assembly guidelines, and automating basic FEA model generation.

Experience Level

Entry-level (Internship). Position intended for students; no specific years of professional experience required.

Responsibilities

Primary responsibilities include:

• Produce and implement designs to meet customer specifications for packaging and RF subsystems, balancing performance, size, cost, and schedule.
• Design, test, and tune RF power amplifiers.
• Develop and execute test plans for electronic package mechanical robustness and quality (ruggedness, ESD).
• Use lab equipment (signal generators, spectrum/network analyzers, power meters) to validate simulations against measurements.
• Perform circuit simulations and partner with technicians on testing.
• Develop application and assembly guidelines for integrating packages into next-level assemblies.
• Create basic algorithms to automate FEA model generation.

Requirements

Must-have and preferred skills:

• Must-have: Proficiency with Microsoft Office (Excel, Word, PowerPoint); strong written and verbal communication; effective organization and planning skills; detail-oriented self-starter.
• Preferred / Nice-to-have: RF circuit design coursework or experience; exposure to RF measurement equipment (spectrum and network analyzers); familiarity with ADS, HFSS, Momentum, FEM tools, Cadence, Dynamic Link, 3D CAD, and mechanical FEA; experience with transistor-level circuit design and analog/RF measurement.

Education Requirements

Currently pursuing a BS, MS, or PhD in Electrical Engineering or Mechanical Engineering. Minimum 3.0 GPA.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.