Design Architecture Principal Engineer
Principal engineer responsible for HBM design architecture and system‑level analysis for next‑generation AI platforms. The role analyzes infrastructure trends, builds performance models, and develops tooling to inform memory subsystem requirements and architectural tradeoffs.
Works with architects and senior engineers across DTPCO, Design, and Product/System teams to translate AI workload needs into actionable memory and system strategies.
Senior (Principal-level). Specific years of experience not specified.
Lead architecture analysis, modeling, and cross-functional alignment for HBM and memory subsystems within AI systems.
Core technical skills and domain experience required for the role. Degree requirements are summarized separately below.
Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related technical field, or equivalent practical experience. (Source also references related technical fields and equivalent practical experience.)
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
