Job Title
Data Center MLB Reliability Engineer
Role Summary
The Datacenter Motherboard (MLB) Reliability Engineer will define and execute board-level reliability strategy for next-generation data center motherboards used in high-performance computing (HPC) server systems. You will translate system-level availability and RAS requirements into component and board validation, drive physics-of-failure analysis, and lead reliability testing and root-cause investigations across hardware teams.
Experience Level
Mid-level β typically requires around 5+ years of relevant experience in electronics/hardware reliability engineering or equivalent.
Responsibilities
Key responsibilities include developing reliability plans, modeling system availability impact, and validating designs through testing and analysis.
- Lead board-level reliability strategy for HPC motherboards and server systems.
- Perform Design and Process FMEA to identify and mitigate failure modes early in design.
- Apply physics-of-failure techniques to semiconductor packages, second-level interconnects (SLI), and PCB materials.
- Develop and apply reliability models (Reliability Block Diagrams, Markov chains, Bayesian analysis) to quantify board-level risk and system availability impact.
- Translate RAS and availability targets for large-scale data center deployments into board-level design and validation criteria.
- Design and execute Mechanical Stress, Environmental, and Accelerated Life Testing programs.
- Lead Root Cause Analysis (RCA) and statistical assessment of design maturity and field returns.
- Collaborate with cross-functional teams to convert system requirements into component specifications and test plans.
Requirements
Must-have technical skills and experience. Preferred items listed separately.
- Minimum ~5 years relevant experience in electronics or board reliability engineering (experience in server/HPC boards preferred).
- Proficiency in statistical life-data analysis and reliability metrics interpretation.
- Practical experience with semiconductor package integration, SLI reliability, passive components, PCB reliability, bonding materials, and warpage control.
- Experience applying FMEA methodologies and leading failure-mode mitigation efforts.
- Proven ability to design and run environmental, mechanical stress, and accelerated life tests.
- Strong written and verbal communication skills; able to explain complex statistical findings to non-experts.
- Ability to manage multiple projects in a fast-paced, cross-functional environment.
Nice-to-have:
- Experience applying reliability modeling (Markov, RBD, Bayesian) specifically to data center architectures.
- Familiarity with reliability tools such as Weibull++, BlockSim, JMP, or Minitab and scripting for statistical modeling (Python, R, MATLAB).
- Background in large-die packages, heterogeneous integration, and high-power server motherboard reliability.
- Advanced degree (MS/PhD) or record of innovation in reliability methodologies.
Education Requirements
Minimum: Bachelor's degree (BS) in Materials Science, Electrical Engineering, Mechanical Engineering or equivalent field is stated as desired alongside ~5+ years of experience. Preferred: MS or PhD in Reliability Engineering, Systems Engineering, Electrical Engineering, Materials Science, or equivalent. Equivalent practical experience is noted as acceptable.
About the Company
Company: Apple
Headquarters: Cupertino, California, United States
Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.

Date Posted: 2026-08-03