Customer Integration Engineer (HBM)

Job Title

Customer Integration Engineer (HBM)

Role Summary

Work within the Customer Engineering Technical Leadership function (HIG PSE) to enable integration of advanced HBM products into customer systems across product development, system architecture, process, package failure analysis, qualification, and test. The role emphasizes hands-on technical problem solving and cross-functional coordination.

Regular development and use of AI tools is expected as part of day-to-day operations. For application assistance or reasonable accommodations, contact hrsupport_taiwan@micron.com.

Experience Level

Mid-level. The posting does not state specific years of experience; suitable for candidates with prior hands-on experience in product development, systems build, process, PFA, qualification, or test.

Responsibilities

Primary responsibility is technical engagement with customers and internal teams to integrate and qualify HBM products.

• Apply technical expertise in one or more domains: product engineering, system engineering, build, front-end/back-end process, PFA, qualification, or test.
• Integrate customer requirements into internal design and manufacturing processes.
• Participate in technical reviews, debug sessions, and failure analysis activities.
• Collaborate with build, product engineering, and manufacturing teams to resolve technical challenges.
• Support yield improvement and qualification efforts tied to customer programs.
• Provide clear technical updates and documentation to internal and external stakeholders.

Requirements

Looking for hands-on engineering experience, strong problem solving, and effective cross-functional collaboration. Education requirements are listed separately below.

• Must-have: Hands-on experience in one or more areas: product development, systems build, front-end/back-end process, PFA, qualification, or test.
• Must-have: Ability to participate in technical reviews, debug sessions, and failure analysis; work with manufacturing and product teams to resolve issues.
• Must-have: Strong analytical and problem-solving skills and effective communication across teams.
• Preferred: Familiarity with HBM architecture, packaging technologies, and industry-standard processes.
• Preferred: Demonstrated ability to develop expertise beyond a primary subject area through cross-training and on-the-job learning.

Education Requirements

Bachelor's or Master's degree (or equivalent practical experience) in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.