CryoCMOS Design Director, Quantum

Job Title

CryoCMOS Design Director, Quantum

Role Summary

The CryoCMOS Design Team Manager leads a multidisciplinary team of approximately 10–20 analog, RF, digital, mixed-signal, and physical design engineers to deliver cryogenic CMOS integrated circuits and reusable design IP for quantum and other advanced applications.

Accountable for technical and people leadership across the full IC lifecycle: architecture, circuit design, verification, tapeout, silicon bring-up, and design-to-silicon correlation, and for partnering with PDK, modeling, test, packaging, and customers.

Experience Level

Senior - minimum 10 years of relevant semiconductor IC design experience with progressively increasing technical leadership responsibilities.

Responsibilities

Manage the CryoCMOS design organization and deliver end-to-end IC development and reusable design solutions.

• Lead and manage a multidisciplinary CryoCMOS IC design team (~10–20 engineers): set technical direction, priorities, resource plans, and execution strategy across analog, RF, digital, mixed-signal, and physical design.
• Drive end-to-end development: system and circuit architecture, design, simulation, verification, physical implementation, tapeout, silicon bring-up, and characterization.
• Provide technical leadership through architecture and design reviews, methodology definition, performance optimization, design closure, and critical issue resolution.
• Develop differentiated IC solutions, reusable IP, and enablement capabilities that leverage process technologies for cryogenic and quantum applications.
• Partner with PDK, compact modeling, technology development, test, packaging, and design enablement teams to translate process capabilities into manufacturable IC solutions and identify modeling or design gaps.
• Establish and improve IC design processes, technical review mechanisms, quality standards, and execution metrics for predictable delivery and successful tapeouts.
• Recruit, coach, mentor, and develop engineering talent; manage performance and succession planning.
• Collaborate with internal stakeholders, customers, and ecosystem partners to translate system requirements into design roadmaps and executable programs.

Requirements

Must-have technical skills, leadership experience, and execution capability.

• Minimum 10 years of semiconductor IC design experience with progressively increasing technical leadership responsibility.
• Proven experience leading multidisciplinary IC design teams spanning analog, mixed-signal, RF, digital, or physical design.
• Demonstrated ability to lead complex IC development through architecture, design, verification, physical implementation, tapeout, silicon bring-up, and characterization.
• Strong understanding of CMOS IC design, semiconductor devices, design methodologies, physical implementation, PVT variation, parasitic effects, and silicon characterization.
• Ability to manage multiple complex programs, prioritize engineering resources, mitigate technical and program risks, and deliver against schedule.
• People leadership: recruiting, coaching, performance management, and development of technical leaders.
• Effective written and verbal communication across engineering teams, customers, and senior leadership.
• Travel: up to 10%.

Nice-to-have:

• Experience with cryoCMOS, quantum-control/readout electronics, or low-temperature electronics.
• Experience establishing or scaling an IC design capability, including reusable IP, design flows, and tapeout execution practices.
• Experience working closely with PDK, compact modeling, EDA, test, packaging, and silicon characterization teams.
• Project management and customer engagement experience translating system-level requirements into IC solutions.

Education Requirements

Required: Bachelor's degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field. Preferred: Master's degree or PhD in Electrical Engineering, Microelectronics, Computer Engineering, Applied Physics, or a related field.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.