Component Quality Engineer

Job Title

Component Quality Engineer

Role Summary

Responsible for end-to-end component and logic-board (MLB) quality for consumer electronics products, focusing on semiconductor ICs, passives, packaging, and PCB assemblies. The role works across product design, test, supplier quality, contract manufacturers, and field organizations to ensure manufacturing quality and product readiness.

Primary activities include vendor auditing, failure analysis, quality monitoring, and driving corrective actions through development and sustaining phases.

Experience Level

Mid-level. The posting does not specify a required number of years of experience.

Responsibilities

Key responsibilities include vendor oversight, quality assurance for components and boards, and cross-functional program communication.

• Perform vendor audits across fab process, wafer-level test, final test, and packaging; produce audit reports and drive remediation.
• Drive and track closure of component/module issues that affect product readiness or DPPM.
• Provide real-time feedback from sustaining issues and manage post-ramp quality requirements.
• Approve quality risk and mass-production releases and ensure follow-through on qualifications.
• Communicate program risks and resolution plans to executive management.
• Detect and investigate component quality and manufacturing issues during development and sustaining phases.
• Manage quality reviews, audits, and on-site support at supplier and contract manufacturer locations.
• Prevent and correct quality issues across logic boards, components, and assemblies.
• Collaborate with design, test, product quality, supplier quality, and field teams to resolve defects and improve processes.

Requirements

Must-have skills and experience are listed first; preferred skills follow.

Must-have

• Experience in one or more: fab process operations, test, design or product engineering, reliability, or qualification.
• Experience with design and manufacturing of systems, PCB assemblies, assembly processes, and test.
• Broad IC packaging experience (e.g., WLCSP, SoC, QFN) and knowledge of fab and package assembly processes.
• Strong product reliability knowledge and fundamentals.
• Advanced failure analysis skills for systems and circuits, including cross-sectional analysis, optical microscopy, X‑ray, SEM/EDS, FTIR, XPS.

Nice-to-have

• Familiarity with test strategies (in-circuit, board functional tests) and industry test methodologies such as JTAG.
• Proven root cause analysis (RCA) and corrective-action experience; familiarity with 8D and RCCA.
• Experience with system manufacturing, SMT, and transitioning new products into production.
• Experience with quality metrics, SPC, and engineering DOE methodologies.
• Strong technical communication skills and the ability to present deep engineering analysis to stakeholders.
• Experience working with offshore manufacturers and willingness to travel to manufacturing sites.
• Industry leadership or certifications (preferred), and experience in consumer electronics quality processes.

Education Requirements

The posting emphasizes Electrical Engineering skills and familiarity with circuit and system design; it also references industry leadership such as ASQ. No specific degree (Bachelor's, Master's, PhD) or explicit "degree required" language is stated.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.