Component Process Engineer

Job Title

Component Process Engineer

Role Summary

Serve as the primary substrate engineering interface between hardware design, package manufacturing teams, and global substrate suppliers. Focus on FR4/PCB technology development, process qualification, supplier selection, and manufacturability guidance for high-speed optical hardware.

Experience Level

Senior — requires 8+ years of experience in FR4 substrate or PCB development or manufacturing.

Responsibilities

Lead substrate and process development, qualification, and cross-functional execution.

• Identify, develop, and qualify FR4/PCB substrate suppliers worldwide.
• Lead DFM/DFT/DFR reviews, perform risk analysis, and implement mitigation plans with suppliers.
• Drive FR4/PCB quality control, failure analysis, and reliability testing.
• Provide manufacturability guidance to PCB/substrate design teams during early development.
• Support packaging production process development (SMT, die attach, wire bond, active alignment, testing) and transfer to production.
• Collaborate with cross-functional teams to resolve process and supplier issues at scale.

Requirements

Must-have technical skills and experience.

• 8+ years in FR4 substrate or PCB product development or manufacturing, with in-depth knowledge of mSAP and Any-Layer HDI processes for high-speed optical transceivers.
• Hands-on familiarity with relevant equipment, materials, and typical process capabilities.
• Experience with PCB layout tools such as Cadence and mechanical design tools such as SolidWorks.
• Experience with statistical tools such as JMP and working knowledge of PCB test methodologies.
• Familiarity with FMEA, Control Plan, SPC, 8D problem-solving.
• Fluent English for stakeholder communication.
• Willingness to travel 30–50% within Asian countries.

Nice-to-have:

• Experience with optical transceiver manufacturing processes (SMT, die attach, wire bonding, active alignment).
• Six Sigma or advanced statistical analysis skills.

Education Requirements

Required: B.S. or M.S. in Materials, Chemistry, or Mechanical Engineering. Preferred: M.S. in Electrical or Manufacturing Engineering. (No explicit equivalent-experience statement provided.)

About the Company

Company: Lumilens

Headquarters: San Jose, CA, USA

Lumilens develops integrated photonics and optical interconnect solutions for high-speed data communication and chip-to-chip interfaces, focusing on optical front-end hardware and co-packaged optics for advanced semiconductor systems.