Co-Packaged Optics Packaging Process Development Engineer

Job Title

Co-Packaged Optics Packaging Process Development Engineer

Role Summary

Lead development and industrialization of assembly and packaging processes for co-packaged optics and advanced AI products, working with foundries and OSATs to move designs from prototype through NPI to high-volume manufacturing. The role emphasizes process engineering, supplier management, reliability, and cost control.

Experience Level

Senior — 10+ years of experience in semiconductor packaging, process and technology development.

Responsibilities

Drive packaging process technology, qualification, and ramp to manufacturing in collaboration with cross-functional teams and external suppliers.

• Lead process development at foundries and OSATs for 2.5D/3D CoW and advanced packaging solutions.
• Develop and manage chemistry and consumables strategies with suppliers to support prototypes and HVM cost targets.
• Identify and mitigate technical and schedule risks during NPI; ensure factory readiness.
• Manage package qualification with emphasis on thermo-mechanical reliability and physics-of-failure analysis.
• Coordinate internal and external resources to meet program milestones and cost objectives.
• Present technical and program status to engineering leadership and executives.

Requirements

Key technical skills, experience, and program responsibilities required for the role.

Must-have

• 10+ years' experience in semiconductor packaging process and technology development.
• Hands-on experience in wafer process development and 2.5D/3D CoW assembly development; experience working with consumable suppliers.
• Expert understanding of advanced foundry process nodes and their interaction with packaging/assembly/substrate technologies.
• Deep knowledge of advanced packaging interconnects (including TSVs) across 2.5D/3D form factors.
• Proven track record of moving products from technology development through package definition, qualification, NPI and HVM.
• Working knowledge of package architecture, design rules, BOM, enabling materials/processes, DFM, reliability, and cost drivers.
• Familiarity with component and system level reliability testing and failure analysis.
• Project management experience and ability to communicate technical status and issues to executives.
• Strong problem-solving skills, attention to detail, and ability to work independently.
• Eligibility to access export-controlled technology as required by U.S. export regulations.

Nice-to-have

• Experience with photonics packaging.
• Prior experience driving aggressive cost-reduction strategies for packaging solutions.

Education Requirements

M.S. or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics is required.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.