CMOS Advanced Packaging Development Technical Program Manager

Job Title

CMOS Advanced Packaging Development Technical Program Manager

Role Summary

Lead cross-functional technology and product development programs for advanced CMOS packaging (2.5D/3D, hybrid/fusion bonding, TSV, interposers, die-to-wafer/wafer-to-wafer integration) from early demonstrations through qualification and manufacturing transfer. Role is within the Advanced Packaging team supporting the CMOS product portfolio, based in Malta, NY.

Experience Level

Senior-level. The role requires substantial technical leadership and program management experience in semiconductor process integration and technology development.

Responsibilities

Manage and deliver complex semiconductor technology development programs across multiple technical workstreams and organizations.

• Serve as program manager for advanced packaging technology development initiatives.
• Define and maintain program schedules, milestones, resource plans, and critical-path management.
• Coordinate cross-functional teams (integration, module development, manufacturing, product engineering, PDK, modeling, IP, quality, operations) to define work packages and achieve targets.
• Partner with process integration to establish development flows, run hardware, and meet technical, yield, and reliability objectives.
• Ensure smooth transition from development to qualification and manufacturing transfer.
• Communicate program status, risks, mitigations, and decisions to stakeholders, customers, and executive leadership; prepare technical and executive presentations.
• Support continuous improvement, EHS requirements, and occasional travel (<10%).

Requirements

Must-have technical and program management skills for semiconductor integration and product development. Education specifics are listed under Education Requirements.

• Strong working knowledge of CMOS process integration and semiconductor technology development.
• Proven program/project management skills: risk management, issue resolution, dependency tracking, and critical-path control.
• Experience working effectively in cross-functional and multicultural teams; strong written and verbal communication in English.
• Proven track record delivering complex engineering programs from concept through manufacturing transfer; experience with volume manufacturing is desirable.
• Hands-on familiarity with lot handling, DOE, inline/HOL/ET analysis, monitoring, yield learning, and data-driven problem solving.
• Experience with statistical methods, FMEA/8D methodology, and customer-facing engagement.
• Nice-to-have: advanced packaging experience (TSV, hybrid/fusion bonding, die-to-wafer, wafer-to-wafer, heterogeneous integration); project management certification (PMP, IPMA).

Education Requirements

Master's, Diploma, or Ph.D. in Engineering or Science (for example Physics, Chemistry, Materials Science, Electrical Engineering, or related fields) from an accredited university is required/preferred. Equivalency guidance provided by the employer: B.S. plus a minimum of 15+ years relevant experience, M.S. plus a minimum of 10 years relevant experience, or Ph.D. plus a minimum of 8 years relevant experience.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.