Chip Lead

Job Title

Chip Lead

Role Summary

Lead cross-functional execution and delivery of Automotive ASIL‑B/D SoCs and Data Center SoCs within the AI & Chip Engineering organization. Serve as the central design point of contact across architecture, IP, technology, packaging, verification, validation and product teams to define, execute and productize complex SoC projects.

Experience Level

Senior — expects extensive senior-level experience. The role requires a long track record of SoC/chip development and leadership of engineering teams.

Responsibilities

Accountable for end-to-end product definition and execution; coordinate cross-functional teams to meet quality, schedule and cost targets.

• Lead product definition and execution for Automotive ASIL‑B/D SoCs and Data Center SoCs.
• Collaborate with Systems, Marketing, Product/Technical Engineering and Architecture to define requirements and make architecture trade-offs using data-driven analysis.
• Evaluate and select IP, technology nodes and packaging options with internal and external partners.
• Coordinate handoffs and resolve integration issues across frontend, verification, AMS, DFT, emulation, validation and physical implementation teams.
• Oversee requirements and definition management to ensure implementation meets specifications and safety requirements.
• Work with post‑silicon validation, characterization, application and software teams to identify and resolve design issues.
• Partner with Test and Product Engineering to enable productization and ramp to production.
• Drive program visibility with PMO, articulate dependencies, risks and resource needs to achieve timely delivery.
• Assess workload, establish predictable project plans, and mentor engineers across functions.

Requirements

Must-have experience and capabilities required to perform the role; nice-to-have items are listed after must-haves.

• Must-have: 15+ years of design and development experience with at least 5 years leading complete designs and engineering functions.
• Must-have: Proven experience leading global, cross-functional teams on complex SoC projects.
• Must-have: Strong working knowledge of SoC implementation flows and the ability to resolve cross-functional integration challenges (frontend, verification, AMS, DFT, emulation, validation, physical implementation).
• Must-have: Experience coordinating with IP, technology and packaging partners and making trade-offs for cost, performance and manufacturability.
• Must-have: Program-level planning, risk management and stakeholder communication skills.
• Nice-to-have: Experience leading designs at smaller geometries and familiarity with automotive safety and reliability requirements.

Education Requirements

Source lists a Bachelor’s degree in Engineering required and an MS in Electrical Engineering preferred. Higher-level academic credentials may substitute for some experience; equivalent practical experience is indicated as acceptable.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.