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CAD Engineering Student (Intern)

Ceva
May 19, 2026
Internship
On-site
Raanana, Center District, Israel
EDA Jobs, Level - Entry or Early Career

Job Title

CAD Engineering Student (Intern)

Role Summary

Join Ceva's VLSI CAD, DevOps, and Emulation team to support automation, release processes, and emulation flows for advanced AI and DSP ASIC development. The role offers hands-on exposure to full-chip development environments and infrastructure engineering.

Experience Level

Entry-level internship position for current undergraduate students. No specific professional experience level required beyond the student status described in Education Requirements.

Responsibilities

Contribute to VLSI infrastructure and tooling to improve development and verification efficiency.

  • Support VLSI infrastructure, automation flows, and release processes.
  • Develop and maintain CAD/DevOps scripts and tooling under guidance.
  • Participate in emulation activities and environment setup.
  • Collaborate with design and verification teams to streamline flows and improve engineering productivity.
  • Document work and hand off scripts/tools to team members as needed.

Requirements

Core expectations and preferred skills for candidates.

  • Must-have: Availability to work 20–25 hours per week; strong problem-solving and analytical skills; effective verbal and written communication.
  • Other: Candidates are asked to attach an updated grades sheet with their application.
  • Nice-to-have: Experience with scripting languages (Python, Bash), familiarity with Linux/Unix environments, exposure to VLSI/CAD tools or flows, prior experience with automation or DevOps tools.

Education Requirements

Enrolled B.Sc. student in Electrical Engineering, Computer Engineering, Physics, Mathematics, or a closely related technical field; at least three semesters remaining until graduation.


About the Company

Company: Ceva

Headquarters: Herzliya, Israel

Ceva is a semiconductor IP licensor specializing in wireless connectivity and smart sensing technologies. It provides digital signal processors, AI processors, wireless platforms and software for sensor fusion, image enhancement, computer vision, voice input and other AI-enabled functions for connected devices.

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Date Posted: 2026-05-17