BEOL Process Integration Engineer (up to Sr. Staff)
QualcommJob Title
BEOL Process Integration Engineer (up to Sr. Staff)
Role Summary
Lead BEOL interconnect process development, qualification, and manufacturing enablement for advanced technology nodes and advanced packaging. Work cross-functionally with foundries, packaging partners, design, reliability, and manufacturing teams to meet product PPAC, yield, performance, and reliability targets.
Experience Level
Senior (up to Sr. Staff). Typical guidance: 5+ years of semiconductor industry experience in back-end process integration; advanced degree preferred for Staff/Senior Staff roles.
Responsibilities
Main responsibilities include technical leadership of BEOL integration, qualification, and HVM readiness.
- Define and lead BEOL process integration strategy and technology development for advanced nodes (sub-5nm/2nm and beyond).
- Serve as primary technical interface with foundry partners for process definition, optimization, qualification, and manufacturing readiness.
- Drive pathfinding and qualification of advanced packaging (2.5D/3DIC), chiplets, and heterogeneous integration.
- Translate PPAC (Power, Performance, Area, Cost) requirements into process specifications and integration solutions.
- Optimize interconnect RC performance and evaluate process options to achieve product objectives.
- Investigate yield, reliability, and parametric issues; lead root-cause analysis and corrective actions with partners.
- Define process control and monitoring strategies to ensure capability and manufacturing quality.
- Lead technology qualification, new technology introduction (NTI), and high-volume manufacturing (HVM) readiness activities.
- Collaborate with design, product engineering, advanced packaging, reliability, and manufacturing teams.
Requirements
Must-have and preferred technical qualifications. Degree and field expectations are listed under Education Requirements.
- Must-have: 5+ years of experience in back-end process integration or technology development for advanced logic/packaging nodes.
- Must-have: Experience with interconnect materials and processes (Cu/Ru metallization, low-k/ultra-low-k dielectrics, barrier/liner films, dual-damascene).
- Must-have: Strong understanding of process interactions, yield learning, defect mechanisms, reliability, and root-cause analysis.
- Must-have: Familiarity with lithography, etch, CMP, CVD/ALD deposition, and wet clean unit processes and their interactions in an integrated flow.
- Must-have: Proficiency with statistical process control and analysis methods (SPC, DOE, FMEA, Cpk/Ppk, JMP or equivalent).
- Must-have: Experience interfacing with external foundry partners on process development, design-rule negotiation, and PDK/technology deliverables.
- Nice-to-have: Experience with failure analysis techniques (TEM, SEM, EDX, FIB).
- Nice-to-have: Familiarity with heterogeneous integration processes (hybrid bonding, wafer bonding, TSV, backside metallization) and 3DIC packaging.
Education Requirements
Bachelor's, Master's, or Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Science, Engineering, or a related technical field. Advanced degree (M.S./Ph.D.) is preferred for Staff and Senior Staff levels. The posting also lists experience-based alternatives (e.g., Bachelor's +6 years, Master's +5 years, Ph.D. +4 years) for related ASIC or engineering roles.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
