ATD MIHL Equipment Development Engineer

Job Title

ATD MIHL Equipment Development Engineer

Role Summary

Work on Intel's Packaging Module Development team to design and optimize packaging processes and equipment that support next-generation assembly and packaging technologies. The role focuses on improving manufacturability, reliability, yield, and productivity for semiconductor packaging.

Experience Level

Mid-level. Typical candidates meet the minimum experience thresholds listed in the posting (see Education Requirements for degree/experience combinations); expect roughly 2–4 years of relevant industry experience.

Responsibilities

Core responsibilities include developing equipment and processes, testing under field-like conditions, and driving manufacturability and reliability improvements.

• Develop and refine packaging processes and equipment to meet quality, reliability, cost, yield, and productivity targets.
• Apply Design of Experiments (DOE) and statistical methods to optimize processes; document results in technical reports.
• Design and maintain equipment for evaluating packaging technologies under heat, humidity, temperature cycling, and dynamic forces.
• Ensure manufacturability of package layouts and manage manufacturing workflow lifecycles.
• Define material specifications and work with supplier quality and procurement to ensure compliance.
• Invent and implement inspection techniques, tools, and quality screens to identify and mitigate reliability issues.
• Set reliability benchmarks based on failure-mechanism analysis to meet customer needs.
• Lead problem-solving initiatives and continuous improvement efforts for equipment and processes.
• Provide technical consultation to internal teams and partners on packaging challenges and solutions.
• Standardize product qualification practices and manage technical risks aligned to product milestones.

Requirements

Must-have technical skills and competencies; preferred items listed separately.

• Proficiency with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Familiarity with mechanical drawings and Geometric Dimensioning & Tolerancing (GD&T).
• Competency in mechanical design software such as SolidWorks or AutoCAD.
• Experience designing or maintaining test/evaluation equipment and qualifying processes.
• Experience with reliability testing and environmental simulation (thermal, humidity, vibration).
• Supplier collaboration and cross-functional communication skills for material and quality control.
• Strong problem-solving skills and experience leading technical projects and continuous improvement.

Preferred:

• Understanding of semiconductor fabrication and packaging technologies.
• Experience with supply chain management in manufacturing or materials qualification.
• Familiarity with high-precision manufacturing methods (stamping, CNC machining).
• Proven ability to lead technical innovation and manage complex, time-sensitive projects.

Education Requirements

One of the following degree + experience combinations is required: Bachelor's in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience; OR Master's in a related STEM field with 2+ years; OR PhD in a related STEM field with at least 6 months of relevant experience. Posting indicates relevant experience may be obtained through a combination of industry work, internships, coursework, or research. (The position is not eligible for Intel immigration sponsorship.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.