ATD MIHL Equipment Development Engineer

Job Title

ATD MIHL Equipment Development Engineer

Role Summary

Work on Intel's Packaging Module Development team to design, develop, and maintain equipment and processes that support advanced semiconductor packaging. The role focuses on improving manufacturability, yield, reliability, and productivity for next-generation packaging solutions.

Experience Level

Mid-level. Typical candidates have around 3+ years of relevant industry experience; variations exist depending on degree level and prior experience.

Responsibilities

Accountable for developing packaging equipment and processes, setting reliability benchmarks, and driving continuous improvement.

• Develop and refine packaging processes and equipment to meet targets for quality, reliability, cost, yield, and productivity.
• Apply Design of Experiments (DOE) and statistical methods to optimize processes; document results in technical reports.
• Design, build, and maintain equipment to evaluate packaging under simulated field conditions (heat, humidity, temperature cycling, dynamic forces).
• Ensure manufacturability of physical layouts and oversee manufacturing workflow lifecycles.
• Define material specifications and work with supplier quality and procurement to ensure compliance.
• Develop techniques, tools, and quality screens to identify and mitigate packaging reliability issues.
• Lead problem-solving activities and drive continuous improvement in equipment and processes.
• Provide technical consultation to internal teams and partners on packaging challenges and solutions.
• Standardize product qualification practices and manage technical risk relative to product milestones.

Requirements

Core technical skills and practical experience required; preferred items listed separately.

• Proficiency with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing (GD&T).
• Competency in mechanical design software such as SolidWorks or AutoCAD.
• Experience in mechanical/equipment design and evaluation under thermal and mechanical stress conditions.
• Process optimization, reliability-focused development, and technical problem solving.
• Ability to define material specifications and collaborate with suppliers and procurement.
• Strong communication and cross-functional collaboration skills; ability to lead technical projects.
• Must be authorized to work in the hiring country; this role is not eligible for Intel immigration sponsorship.

Preferred (nice-to-have):

• Understanding of semiconductor fabrication and packaging technologies.
• Familiarity with supply chain and materials qualification processes in manufacturing environments.
• Experience with high-precision manufacturing methods (stamping, CNC machining).
• Proven track record of leading technical innovation and managing complex, time-sensitive projects.

Education Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with ~3+ years relevant experience; OR Master's degree in those fields with ~2+ years; OR PhD in those fields with ~6 months relevant experience. Qualifications may also be met through a combination of industry experience, internships, coursework, or research (equivalent practical experience).

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.