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ATD Laser Development Engineer

Intel Corporation
August 27, 2026
Full-time
On-site
Phoenix, Arizona, United States
$85,200 - $162,500 USD yearly
Process Engineering Jobs, Level - Entry or Early Career

Job Title

ATD Laser Development Engineer

Role Summary

Develop laser assembly and packaging processes and equipment for advanced semiconductor packaging. Work within a packaging/module development team to define process specifications, improve manufacturability, and ensure quality and reliability of laser-based assembly solutions.

This role involves cross-functional collaboration with design, process, and supplier teams to drive process qualification and production readiness.

Experience Level

Entry-level / College graduate. Suitable for candidates at the start of their engineering career (new college grads or those with limited industry experience).

Responsibilities

Key responsibilities include process development, optimization, and qualification for laser assembly packaging.

  • Design and develop laser assembly packaging processes and related equipment.
  • Optimize processes for quality, reliability, cost, yield, and productivity.
  • Develop process and equipment specifications using Design of Experiments (DOE) and data analysis.
  • Manage manufacturability of physical layouts and full packaging process flows.
  • Establish laser process specifications and work with suppliers to meet standards.
  • Innovate techniques and screens to identify packaging quality and reliability issues early.
  • Define laser process reliability requirements informed by failure mechanisms.
  • Drive standardization of qualification procedures and manufacturing quality systems.

Requirements

Must-have technical skills and experience; preferred items listed separately.

  • Proficiency with Statistical Process Control (SPC) and Design of Experiments (DOE) methods.
  • Fundamental understanding of laser and optical systems.
  • Experience developing process and equipment specifications and analyzing process data.
  • Ability to collaborate with cross-functional teams and meet project milestones.

Nice-to-have:

  • Hands-on experience in manufacturing environments or semiconductor packaging processes.
  • Experience troubleshooting laser-based equipment and process characterization.
  • Familiarity with manufacturability considerations in semiconductor/electronics assembly.
  • Data science/statistics tools: Python, NumPy/Pandas, SQL, JMP, Minitab.

Education Requirements

Bachelor's or Master’s degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field; equivalent practical experience or a combination of relevant industry experience, internships, and coursework is also acceptable.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-08-27