Assembly Media and Collaterals Development Engineer

Job Title

Assembly Media and Collaterals Development Engineer

Role Summary

Engineer responsible for developing and optimizing assembly processes, media, tools and equipment for semiconductor package manufacture. Works on process development, manufacturability, reliability requirements, and supplier/material specifications to meet quality, cost, yield and productivity targets.

Collaborates with packaging technology, supplier quality, procurement and partner engineering groups to qualify processes and mitigate risks for production milestones.

Experience Level

Entry-level / Early career. Minimum 2+ years of relevant engineering or development experience as specified in the posting.

Responsibilities

Key responsibilities include:

• Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield and productivity goals.
• Apply Design of Experiments (DOE) and statistical methods to develop process and equipment specifications and to analyze data.
• Create and maintain test equipment and setups to evaluate package and silicon reliability under thermal, humidity, mechanical and dynamic conditions.
• Ensure manufacturability of package physical layouts and oversee manufactured package processes, procedures and flows.
• Establish material specifications for contract assemblers and raw material vendors; interface with supplier quality and procurement to enforce specifications and qualification methods.
• Develop screening methods, acceleration techniques and quality checks to identify potential packaging issues early.
• Provide technical consultation on packaging problems and respond to customer or production events.
• Document process improvements and contribute to standardization of product qualification and manufacturing quality systems.

Requirements

Must-have and preferred skills:

• Must-have: Minimum 2+ years experience applying fundamental science and engineering concepts in development; strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Experience with analytics and mechanical design tools used in packaging (e.g., AutoCAD, SolidWorks) and working with engineering drawings and tolerancing analysis.
• Practical experience developing or improving manufacturing processes, equipment qualification, or reliability test methods.
• Ability to use experimental design and statistical methods for problem solving and process improvement.
• Nice-to-have: Portfolio of concept-to-fabrication projects (assembly equipment, process, media or collateral); strong mechanical design software proficiency; understanding of semiconductor fabrication processes.

Education Requirements

Required: Bachelor's or Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Physics, or a related field (explicitly listed in the posting).

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.