Assembly Die Bond Process Engineer

Job Title

Assembly Die Bond Process Engineer

Role Summary

Develop, optimize, and sustain die-bonding processes in semiconductor assembly to improve yield, stability, cycle time, and cost. Support manufacturing operations, new product introductions (NPI), and continuous improvement.

Experience Level

Mid-level (Level - Mid-Career). Typically 3–7 years of relevant semiconductor assembly or process engineering experience is expected.

Responsibilities

Key responsibilities include:

• Develop, qualify, and optimize die bonding processes and establish process parameters and operating specifications.
• Perform process characterization and verification; monitor process capability (Cp/Cpk) and manufacturing yields.
• Provide daily engineering support to production, troubleshoot die bond process issues, and analyze yield losses and excursions.
• Support new package development, technology transfers, and NPI activities.
• Conduct root cause analysis and implement corrective and preventive actions (8D, Fishbone, 5 Why, FMEA).
• Support reliability testing and qualification activities.
• Drive continuous improvement initiatives: cost reduction, productivity improvement, and waste elimination using Lean and Six Sigma methods.
• Create and maintain process documentation, work instructions, qualification reports, and technical presentations; ensure compliance with safety and quality standards.

Requirements

Must-have skills and experience and a few preferred qualifications.

• Must-have: Hands-on experience with die bond processes in semiconductor assembly; process characterization and setting operating specifications; production troubleshooting; yield analysis and CAPA implementation; experience with Cp/Cpk monitoring and root cause tools (8D, FMEA, 5 Why).
• Must-have: Ability to support NPI and technology transfer activities and produce clear process documentation and engineering reports.
• Preferred: Experience with Lean Manufacturing and Six Sigma methodologies; familiarity with reliability testing and qualification workflows.
• Other: Strong analytical, problem-solving, and communication skills; adherence to safety, environmental, and customer quality requirements.

Education Requirements

Bachelor's or Master's degree in a related engineering major (as stated in the posting). The posting specifies "Bachelor/Master in related engineering major with semiconductor experience in Die bond."

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.