ASIC Package Design Manager

Job Title

ASIC Package Design Manager

Role Summary

Lead a team designing flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC and 5G. Own technical direction, methodology, team development and delivery for multiple concurrent package-design projects across a global R&D organization.

Experience Level

Senior-level — requires approximately 12+ years of relevant package-design experience with high-speed SerDes and a minimum of 3 years in management.

Responsibilities

Manage people, projects, and technical execution for ASIC package designs.

• Lead and develop engineers; align skills to projects to maximize productivity and retention.
• Create and track project plans for 20+ concurrent designs (scope, schedule, resources).
• Coordinate team, customer, vendor, and cross-functional activities to keep projects on track.
• Define package design methodologies, steer package technology and design rules.
• Communicate plans, status, risks and next steps to stakeholders.
• Support technical work as needed: SI/PI, thermal/mechanical modeling, layout reviews, and automation.

Requirements

Must-have technical and leadership qualifications (degree removed to Education Requirements section).

• 12+ years experience in flip-chip-BGA package design, including high-speed SerDes; minimum 3 years in management.
• Strong knowledge of package-level signal integrity and power integrity applied to package designs.
• Familiarity with the package-design lifecycle and how substrate/package fit into ASIC design and manufacturing flows.
• Experience with design data and documentation (.mcm, package spreadsheets, POD/Lid/Substrate drawings) and DFx trade-offs.
• Hands-on experience with layout, SI/PI extractions and simulations, automation/code development, and mechanical & thermal modeling.
• Proven project management skills and ability to handle multiple concurrent programs.
• Experience collaborating across time zones with internal teams and external vendor designers.
• On-site presence required 5 days per week; occasional travel may be required.

Education Requirements

Preferred: BSEE or MSEE in Electrical Engineering or a similar field. The posting also specifies 12+ years of relevant flip-chip-BGA package-design experience and at least 3 years of management experience.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.