ASIC Package Design Manager

Job Title

ASIC Package Design Manager

Role Summary

Manage an engineering team that designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G. Lead technical direction for package design methodologies, design rules, and cross-functional execution across a worldwide R&D organization.

Experience Level

Senior-level. The posting requests candidates with extensive package-design experience, including management experience (see Requirements for details).

Responsibilities

Lead and organize the team and program execution to deliver multiple concurrent package designs.

• Assess team skills and allocate resources to maximize productivity and retention.
• Create and track project plans for 20+ concurrent designs (scope, schedule, resources).
• Organize team and customer activities to keep projects on schedule; communicate status, next steps, and risks.
• Develop and document technical methodologies for package design.
• Define and steer package technology choices and design rules with input from team members.
• Collaborate with customers, vendors, and cross-functional internal teams.
• Support co-design activities across multiple time zones.

Requirements

Must-have technical and leadership qualifications.

• 12+ years of experience in flip-chip BGA package design, including high-speed SerDes; minimum 3 years in a management role.
• Proven experience managing people and multi-project schedules.
• Knowledge of package-level signal integrity (SI) and power integrity (PI) applied to package designs.
• Practical experience with package design lifecycle, substrate integration, and design data formats (.mcm, package spreadsheets, drawings).
• Experience with DFx tradeoffs (manufacturability, reliability, SI/PI, supply assurance) and layout practices.
• Experience performing SI/PI extractions and simulations and using automation code for design tasks.
• Familiarity with mechanical and thermal modeling relevant to package design.
• Ability to coordinate with global teams and external vendors; strong self-management and organizational skills.

Education Requirements

BSEE or MSEE in Electrical Engineering or a similar technical field (the posting lists BSEE/MSEE or similar field).

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.