ASIC Customer Support Project Manager

Job Title

ASIC Customer Support Project Manager

Role Summary

Lead global customer technical support projects for ASIC design customers, acting as the primary point of contact and single project owner. Coordinate cross-functional engineering, EDA, foundry, and QA resources to resolve high-risk technical escalations and ensure on-time delivery of services.

Drive process improvements, KPI tracking, and documentation to reduce recurring issues and support account growth and retention.

Experience Level

Senior — typically requires more than 10 years of semiconductor industry experience with hands-on ASIC design or customer technical project management; proven experience managing multiple parallel customer programs and escalations.

Responsibilities

Own customer technical support engagements end-to-end and coordinate stakeholders to meet milestones and SLAs.

• Serve as primary liaison for key ASIC customers; manage demand confirmation, schedule planning, resource allocation, milestone tracking and project closure.
• Lead and coordinate resolution of complex ASIC technical escalations (front-end synthesis, P&R, timing closure, power integrity, physical verification, low-power flows).
• Coordinate backend engineering, EDA R&D, foundry contacts, application engineering and QA to prioritize and resolve critical issues.
• Perform risk identification and mitigation planning; run regular risk reviews and escalate major roadblocks.
• Organize technical syncs with global customers, report progress, and manage expectations to maintain strategic relationships.
• Establish and improve standardized support processes and KPIs (issue resolution cycle, on-time closure, customer satisfaction).
• Create and maintain FAQs, operational specifications and best-practice documentation to reduce repeated support effort.
• Support pre-sales technical project planning: evaluate workload, estimate support resources, and inform quotes for key accounts.

Requirements

Must-have

• 10+ years of semiconductor industry experience with solid ASIC design or customer technical project management background.
• Deep understanding of the full ASIC implementation flow from netlist to GDSII and familiarity with mainstream EDA tools and physical design challenges.
• Proven record managing multiple concurrent customer projects, controlling milestones and risks.
• Strong cross-functional coordination and leadership to drive engineering teams under tight schedules.
• Fluent oral and written English for regular communication with overseas customers.
• Customer-oriented with strong conflict management and delivery under pressure.
• Familiarity with project management methodologies and ability to build standardized support processes.

Nice-to-have

• Experience at EDA vendors, IP suppliers, design service companies or leading foundries.
• Hands-on ASIC backend physical design experience (P&R, timing closure, PV troubleshooting).
• Experience supporting data center ASICs, AI accelerators, networking silicon, DPUs/XPUs or custom silicon programs.
• Experience with advanced-node projects (7nm/5nm) and handling high-priority escalations.
• Familiarity with Tcl/Python scripting and technical data analysis/statistics.

Education Requirements

Bachelor's degree or higher in Microelectronics, Electrical Engineering, Integrated Circuit Design, Computer Engineering or related field is expected. Minimum-qualification alternatives in the posting: Bachelor's +6 years relevant experience, Master's +5 years, or PhD +4 years of relevant Hardware Applications Engineering or Hardware Design experience; related practical experience may be considered.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.