Architect - Subsystem
Volantis SemiconductorJob Title
Architect - Subsystem
Role Summary
Own the architecture of a complete sub-block on the A-0 and A-1 systems and ensure it integrates into the broader chip and system. Collaborate with other architects, architecture leaders, microarchitects, implementation and verification teams to deliver a production-capable block.
Experience Level
Senior level. Specific years of experience are not stated, but the role requires demonstrated prior ownership of block-level architecture within larger chip or system projects.
Responsibilities
Primary responsibilities include end-to-end ownership, system integration, and technical collaboration.
- Own architecture and delivery of a full sub-block within the A-0/A-1 systems.
- Define interfaces and integration points with other subsystems and system-level architects.
- Collaborate with microarchitects on implementation and with verification teams to validate the block.
- Make architectural tradeoffs addressing performance, area, power, and scalability.
- Coordinate with physical design and packaging teams as required for block implementation.
Requirements
Concise list of required and preferred qualifications.
- Must-have: Hands-on experience owning and delivering the architecture of a block that was part of a larger chip or system.
- Must-have: Understanding and hands-on experience in the design of AI accelerators.
- Must-have: Experience working with microarchitects on implementation and with verification teams for the block.
- Nice-to-have: Experience with the physical design process for the blocks you owned.
- Nice-to-have: Experience with large die-area chips.
- Nice-to-have: Experience with multi-die and multi-package chips and systems.
Education Requirements
Not specified.
About the Company
Company: Volantis Semiconductor
Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.
