Job Title
APTM Yield Analysis Senior Engineer / Team Leader
Role Summary
Lead yield and defect analysis efforts for advanced packaging technologies across development and high-volume manufacturing. Work with large datasets, inline metrology, and cross-functional engineering teams to identify and resolve yield-limiting mechanisms.
Establish team priorities, influence technical roadmaps, drive corrective actions, and mentor a small team to improve manufacturing processes and defect detection capabilities.
Experience Level
Senior-level. Typical experience guidance: 9+ years with a Bachelor's, 6+ years with a Master's, or 4+ years with a PhD in a relevant technical discipline.
Responsibilities
Deliver technical leadership for yield improvement, defect analysis, and cross-functional coordination.
- Analyze large manufacturing, test, and defect datasets to identify yield-impacting trends and root causes.
- Apply statistical analysis, machine learning, and data mining to extract actionable insights.
- Relate electrical failures to physical defects using failure isolation, failure analysis, DFT, and test methodologies.
- Evaluate inline defect metrology performance and defect monitoring systems; recommend improvements.
- Define and drive corrective actions and influence yield roadmaps across technology and manufacturing organizations.
- Prepare and present technical reports on yield performance, defect trends, and device health.
- Lead and mentor engineers; coordinate with Process Engineering, Integration, Q&R, Product Engineering, and Test Development.
- Support technology transfer and ramp to high-volume manufacturing; travel domestically and internationally as required.
Requirements
Must-have technical skills and experience; preferred items are listed separately.
-
Must-have: 5+ years performing data analysis with tools such as JMP, Python, or equivalent statistical/data-analysis tools.
-
Must-have: Strong statistical analysis, data visualization, and structured problem-solving skills.
-
Must-have: Experience correlating test/electrical failures with process and defect data (FIFA, DFT, sort/test methodologies).
-
Must-have: Demonstrated ability to lead or mentor engineers and influence cross-functional stakeholders.
-
Must-have: Excellent written and verbal technical communication skills.
-
Preferred: Experience with semiconductor manufacturing, advanced packaging technologies, inline defect metrology systems, or high-volume manufacturing environments.
-
Preferred: Experience applying advanced statistical techniques and working with large manufacturing databases and visualization tools.
-
Other: Ability to travel as needed and work independently with minimal supervision.
Education Requirements
Required: Bachelor's degree with 9+ years relevant experience, OR Master's degree with 6+ years, OR PhD with 4+ years. Typical fields: Materials Science & Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Computer Science, Information Systems, Physics, Chemistry, or a related technical discipline; or equivalent practical experience.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-06-16