APTM Yield Analysis/Device Engineer

Job Title

APTM Yield Analysis/Device Engineer

Role Summary

Join Intel's Advanced Packaging Technology and Manufacturing (APTM) Yield Group to improve yield and reduce defects across advanced packaging technologies. The role supports technology development, transfers, and manufacturing ramps by analyzing manufacturing data, driving defect reduction programs, and leading technical problem-solving initiatives.

Experience Level

Mid-level. Typical candidates have several years of semiconductor industry experience (see Education Requirements for degree/experience combinations).

Responsibilities

Primary responsibilities include data-driven yield improvement, failure correlation, defect management, and leading small technical teams or projects.

• Analyze multi-dimensional manufacturing and test datasets to identify yield and device-health issues.
• Apply statistical methods and machine learning to extract actionable insights from production data.
• Correlate electrical and physical failure mechanisms using Failure Analysis, DFT, Sort/Test, and process integration knowledge.
• Manage and optimize inline defect metrology and classification systems; drive inline defect reduction programs.
• Plan and execute experiments and technical transfers to support ramp to High-Volume Manufacturing (HVM).
• Lead and mentor small engineering teams (direct or indirect) to resolve nonstandard yield events.
• Prepare and present concise technical reports and action plans to cross-functional stakeholders.

Requirements

Must-have technical experience and skills for day-one impact. Preferred items are listed separately.

• Proven experience analyzing high-volume manufacturing or factory datasets and deriving actionable conclusions.
• Practical knowledge of failure analysis workflows, DFT, test/sort data interpretation, and process-integration impacts on yield.
• Experience managing defect metrology programs and evaluating detection capabilities.
• Demonstrated ability to lead technical programs, prioritize work with limited oversight, and drive cross-functional problem solving.
• Strong written and verbal communication skills; able to deliver executive-level technical summaries and influence stakeholders.
• Nice-to-have: Hands-on experience with JMP, Python, or equivalent data analysis tools; applying statistical analysis and model-based problem solving; direct experience linking product design or DFT to yield work.

Education Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline with 5+ years semiconductor industry experience; OR Master's degree in a matching discipline with 3+ years semiconductor experience; OR PhD in a matching discipline with 1+ year semiconductor experience. "Related technical discipline" wording is allowed by the posting.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.