Applications Engineer, 3D-IC Solutions Sales

Job Title

Applications Engineer, 3D-IC Solutions Sales

Role Summary

Support consultative sales at semiconductor and electronic equipment manufacturers to secure technical design wins for Siemens 3D-IC solutions, including Innovator3D Integrator/Layout and the Calibre 3DIC product family.

Work with account teams to deliver technical presentations, demonstrations and benchmarks, develop 3D-IC design flows and automation, and coordinate with global peers to support key accounts (primary coverage: Korea). International travel is required.

Experience Level

Mid-level. The role expects experienced engineers (typical incumbents have multiple years of semiconductor experience; the posting identifies 4+ years in the field).

Responsibilities

Core responsibilities focus on technical enablement and account support to win 3D-IC design engagements.

• Drive technical design wins for Siemens 3D-IC solutions across assigned accounts.
• Deliver technical presentations, product demonstrations, benchmarks and proof-of-concept work.
• Develop 3DIC design flows and automation scripts based on customer requirements.
• Provide technical support and collaborate with global teams and key account stakeholders.
• Gather customer requirements, propose solutions, and communicate status to internal and external stakeholders.
• Travel domestically and internationally to support customer engagements.

Requirements

Must-have technical skills and domain knowledge.

• Knowledge of IC and packaging data formats (Verilog, LEF/DEF, GDS, OASIS, ODB++).
• Familiarity with 2.5D/3D-IC integration technologies (for example, TSMC 3DFabric, Intel EMIB/Foveros) and chiplet design concepts.
• Scripting proficiency (Python, Tcl, Perl, or similar).
• Working knowledge of Windows and Linux operating systems.
• Proficiency with Microsoft Word, Excel and PowerPoint.
• Professional working proficiency in English.

Nice-to-have:

• Prior customer-facing or sales-support experience.
• Experience with 2.5D/3D-IC EDA cockpit solutions (Innovator3D Integrator, Cadence Integrity SystemPlanner, Synopsys 3DIC Compiler).
• Experience with IC package/interposer layout tools (Cadence APD, Synopsys IC Compiler, Cadence Innovus) and Siemens Calibre solutions (Calibre DRC/LVS, Calibre 3DSTACK).

Education Requirements

Bachelor's or Master's degree in Electronic Engineering (BSEE or MSEE) and approximately 4+ years of experience in the semiconductor or package design field, as stated in the posting.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.