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Applications Engineer, 3D‑IC Solutions Sales

Siemens
August 04, 2026
Full-time
Remote friendly (Tokyo, JP)
Worldwide
Other Semiconductor Jobs, Level - Mid-Career

Job Title

Applications Engineer, 3D‑IC Solutions Sales

Role Summary

Work with sales and engineering teams to secure technical design wins for Siemens EDA 3D‑IC solutions (Innovator3D Integrator/Layout and the Calibre 3DIC family). Primary territory coverage is key accounts in Japan with integration into a global sales and engineering organization.

Deliver technical presentations, product demonstrations and benchmarks, develop account strategies, and provide onsite customer support as required.

Experience Level

Mid‑level (approximately 3–7 years). The role requests 4 years of demonstrated experience in the semiconductor field.

Responsibilities

Core responsibilities include:

  • Secure technical design wins for Siemens 3D‑IC product offerings.
  • Prepare and deliver technical presentations, demos and benchmark comparisons to customers.
  • Develop technical solutions and account strategies in coordination with sales and global teams.
  • Support key accounts in Japan, provide customer consulting and onsite technical assistance.
  • Coordinate status updates and technical communications with internal stakeholders and customers.
  • Travel domestically and internationally for customer meetings and support.

Requirements

Must‑have technical skills and experience:

  • Knowledge of IC and packaging data formats such as Verilog, LEF/DEF, GDS, OASIS, ODB++.
  • Familiarity with 2.5D/3D‑IC integration technologies (e.g., TSMC 3DFabric, Intel EMIB/Foveros).
  • General understanding of chiplet‑based design challenges and methodologies.
  • Solid scripting skills (Python, Tcl, Perl, or similar) and practical experience with Windows and Linux.
  • Proficiency in Microsoft Word, Excel, and PowerPoint.
  • Professional working proficiency in Japanese and English.
  • Willingness to travel for onsite customer meetings and international travel.

Preferred / nice‑to‑have:

  • Prior customer‑facing experience in EDA or semiconductor roles.
  • Familiarity with 2.5D/3D‑IC EDA cockpit solutions (e.g., Siemens Innovator3D IC Integrator, Cadence Integrity SystemPlanner, Synopsys 3DIC Compiler).
  • Knowledge of IC package/interposer layout methodologies and related EDA tools (e.g., Cadence APD).
  • Direct experience with Siemens Calibre solutions (Calibre DRC/LVS and/or Calibre 3DSTACK).

Education Requirements

Bachelor of Science in Electrical/Electronic Engineering (BSEE) or Master of Science (MSEE) required, plus approximately 4 years of demonstrated experience in the semiconductor industry.


About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.

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Date Posted: 2026-08-02