APAC Digital SoC Test Engineer — Integration/Structural/ATPG/SCAN/MBIST

Job Title

APAC Digital SoC Test Engineer — Integration/Structural/ATPG/SCAN/MBIST

Role Summary

Responsible for development, bring-up, validation, and manufacturing enablement of SoC and chiplet test programs. Focus on structural test content, debug, test efficiency, and robust scalable test solutions on advanced technology nodes.

Work closely with DFT, Design, Yield, Reliability, Product, and Manufacturing Test teams across regions to resolve issues and improve test quality and cost.

Experience Level

Mid-level. Typical candidates have 3–7 years of relevant Test Engineering experience; the posting references 4+ years for senior-level expectations.

Responsibilities

Deliver and support test programs from NPI through high-volume manufacturing, diagnose faults, and optimize test flows.

• Develop, bring up, and validate SoC and chiplet test programs for NPI and production.
• Debug coverage, test-time, yield, and test-escape issues and implement fixes.
• Improve test efficiency and reduce cost through test-time and flow optimization.
• Analyze test and yield data to identify trends and root causes; recommend improvements.
• Collaborate with DFT, Design, Yield, Reliability, Product, and Manufacturing Test engineering teams.
• Coordinate across regions to drive timely issue resolution.
• Communicate technical findings clearly to peers and stakeholders.

Requirements

Core technical skills and hands-on experience required; preferred items noted separately.

• Practical experience in one or more test areas: structural test (ATPG, TDF, MBIST), functional test, high-speed test, characterization, high-voltage stress, or integration.
• Experience with chiplet-based or multi-die products and D2D interface testing challenges.
• Hands-on experience with ATE platforms such as Advantest 93K or Teradyne UltraFLEX / iFlex.
• Proficiency in one or more programming/scripting languages: C++, VB, Java, or Python.
• Experience using test or yield data analysis tools (for example O+, Data Power, Exensio).
• Exposure to test method and test library development, including validation and regression.

Nice-to-have:

• Defining or executing chiplet test strategies, multi-stage test flows, and D2D coverage.
• Experience with advanced technology node bring-up and mentoring junior engineers.
• Familiarity with version control (Git/SVN), issue tracking (JIRA), JMP, or AI-assisted test automation tools.

Education Requirements

Bachelor's or Master's degree in Electrical/Electronic Engineering, Computer Engineering, Computer Science, Engineering, or a related technical field (degrees explicitly listed in the source). No specific certifications were required or listed.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.