Analog/Mixed-Signal Designer
Volantis SemiconductorJob Title
Analog/Mixed-Signal Designer
Role Summary
Design and implement analog and mixed-signal circuits for a production optical PHY. Work within a cross-functional engineering team focused on high-speed Tx and Rx link circuits and successful tapeouts at advanced process nodes.
Experience Level
Mid-level — typically 3–7 years of relevant analog/mixed-signal design and tapeout experience (no explicit years stated in the source).
Responsibilities
Contribute to circuit design, layout, verification, and tapeout activities for high-speed optical PHY components.
- Architect and implement analog and mixed-signal circuits for Tx and/or Rx high-speed communication links.
- Perform design, simulation, layout collaboration, and participate in tapeout and silicon bring-up.
- Collaborate with system and PHY engineers to integrate analog components into the broader PHY.
- Analyze and characterize silicon results; iterate designs to meet performance and yield targets.
- Produce design documentation, specifications, and test plans.
Requirements
Core qualifications and relevant experience required and desirable for the role.
Must-have
- Hands-on experience and multiple successful tapeouts of advanced-node analog and mixed-signal circuit designs.
- Hands-on experience and multiple successful tapeouts of high-speed communication link Tx and/or Rx circuits.
Nice-to-have
- Understanding of PHY architectures and how analog components integrate into the PHY system.
- Experience with clock-forwarded links, particularly clock-forwarded optical links.
- Design and tapeout experience with optical links (Tx or Rx) and AMS circuits for optical components.
Education Requirements
Not specified.
About the Company
Company: Volantis Semiconductor
Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.
