AI Automation Design Packaging Lead

Job Title

AI Automation Design Packaging Lead

Role Summary

Lead design and delivery of AI-driven automation for advanced packaging (substrates, organic interposers, silicon bridges). Drive transitions from manual design to algorithmic and agentic workflows and coordinate cross-functional teams to accelerate heterogeneous-integration tape-outs.

Experience Level

Senior-level position. No explicit years-of-experience stated; role expects proven technical leadership and experience driving automation initiatives.

Responsibilities

Primary responsibilities include developing, deploying, and maintaining automation and AI workflows for advanced packaging design and coordinating across teams and vendors.

• Drive development and deployment of AI/ML workflows for substrate, interposer, and silicon-bridge design methodologies.
• Apply AI/ML to optimize auto-routing, component placement, and signal-integrity related stages.
• Collaborate with EDA vendors and internal stakeholders to define feature roadmaps for 2.5D/3D packaging.
• Lead transition from manual design practices to agentic/algorithmic operational models.
• Build closed-loop optimization with electrical/mechanical analysis and simulation feedback.
• Prepare and present executive summaries on automation ROI, efficiency gains, and tool capabilities.
• Coordinate activities across internal and external teams to meet tape-out and methodology milestones.
• Mentor junior engineers on coding best practices and advanced packaging concepts.

Requirements

Expected skills and permissions. Items marked as "Preferred" are nice-to-have but common for strong candidates.

• Must-have: Proven technical leadership in packaging design automation and the ability to translate physical design needs into scriptable, scalable workflows.
• Must-have: Strong cross-functional collaboration and executive presentation skills.
• Must-have: Experience designing and deploying engineering automation at scale (scripting, tool integration, CI-like workflows).
• Must-have: Authorized to work in the United States; this role is not eligible for visa sponsorship.
• Preferred: Experience with EDA packaging tools (Cadence APD/SIP, Siemens Xpedition, Synopsys 3DIC/Compiler).
• Preferred: Automation development experience using Python, Tcl, SKILL, or C++.
• Preferred: Practical experience applying AI/ML frameworks (PyTorch, TensorFlow) to engineering or design problems.
• Preferred: Familiarity with advanced packaging architectures (2.5D/3D, chiplets, fan-out, hybrid bonding) and verification flows (DRC/LVS) and electrical extraction concepts.
• Preferred: Demonstrated mentoring and people-leadership experience.

Education Requirements

Bachelor's or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field with relevant packaging experience.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.