Advanced Packaging Technology Development Process Integration Engineer

Job Title

Advanced Packaging Technology Development Process Integration Engineer

Role Summary

As a Process Integration Engineer in Advanced Packaging Technology & Manufacturing (APTM) at Intel's Rio Rancho site, you will develop and qualify advanced packaging processes and enable readiness for high-volume manufacturing. The role partners with module, device, yield, reliability, and packaging teams to close defects, improve yield, and deliver robust base die solutions.

Experience Level

Mid-level. Typical background: Bachelor's degree plus 3+ years' relevant experience, Master's plus 2+ years, or PhD (no prior experience required).

Responsibilities

Primary duties include process development, yield and reliability improvements, and cross-functional transfer to manufacturing.

• Develop and qualify advanced packaging technology nodes to enable manufacturing readiness.
• Identify and close defect, yield, reliability, and device entitlement gaps.
• Support process readiness reviews and transfer milestones with process module teams.
• Collaborate with device, yield, reliability, packaging, and external stakeholders to deliver base die solutions.
• Contribute to value engineering to reduce cost while maintaining performance.
• Participate in cross-functional problem-solving and root-cause analysis in a fast-paced environment.

Requirements

Must-have skills and experience for initial consideration; preferred items listed separately.

• Relevant experience in process integration, yield analysis, defect reduction, quality management, or process development in semiconductor technology development or manufacturing.
• Knowledge of semiconductor advanced packaging techniques and process flows.
• Experience working in technology development or high-volume manufacturing environments.
• Strong written and verbal communication; ability to convey technical concepts to diverse audiences.
• Proven collaboration and cross-functional teamwork skills.
• Problem-solving mindset and ability to drive accountability and results.

Nice-to-have:

• Experience leading cross-functional problem-solving initiatives.
• Hands-on experience with advanced packaging technologies such as 2.5D, 3D IC, fan-out, or flip-chip.
• Experience supporting technology transfer to high-volume manufacturing.
• Experience with value engineering and cost-reduction initiatives.

Education Requirements

Bachelor's degree in engineering, materials science, physics, or a related field with 3+ years of relevant experience; OR Master's degree with 2+ years of relevant experience; OR PhD (no prior experience required). The posting accepts equivalent combinations of education and relevant experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.